Industrial Technology Research Institute

Unimicron Technology Corporation

Chia-Chi Wu

Ming-Huan Yang

Chao-Kai Cheng

Chung-Wei Wang

Tzyy-Jang Tseng

Cheng-Po Yu

Cheng-Hung Yu

Chang-Ming Lee

Yung-Kuo Ho

A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink-jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.

Multi-layer printed circuit board and method for fabricating the same

A fabrication method of a radio frequency identification (RFID) antenna coil is provided. First, a substrate is processed by a surface modified procedure, to form a self-assembly membranes (SAMs) on a surface of the substrate. A catalyst is sprayed on the SAMs of the substrate according to patterning. After that, the first electroless plating procedure is first carried out for the substrate to generate a magnetic metal layer corresponding to the wiring pattern on the catalyst, and the second electroless plating procedure is then carried out for the substrate to generate the metal layer on the magnetic metal layer.

Fabrication method of radio frequency identification antenna coil

Growing community of inventors

Sindian, Taiwan

Chia-Chi Wu