Everdisplay Optronics (Shanghai) Limited

Chia-chi Huang

Min-ching Hsu

Wei-Ting Chen

Chia-Che Hsu

Hsueh-ming Tsai

Wen-xia Zuo

A TFT array substrate and a manufacturing method of the same are disclosed by the present disclosure. The TFT array substrate includes a base, a light shielding layer, and a low hydrogen layer. The light shielding layer includes a silicon nitride layer formed on the base, and an amorphous silicon light shielding layer formed on the silicon nitride layer. The low hydrogen layer includes a silicon oxide layer formed on the amorphous silicon light shielding layer of the light shielding layer, and a low hydrogen Poly-Si layer formed on the silicon oxide layer. The layer number of the light shielding layer is equal to that of the low hydrogen layer. The time of manufacturing the light shielding layer matched that of manufacturing the low hydrogen layer, which enhances whole capacity of the TFT array substrate dramatically, and reduces risk of the manufacturing process.

TFT array substrate and manufacturing method of the same

The present application provides a thin film transistor, an active matrix organic light emitting diode assembly and a method for manufacturing the same. The thin film transistor includes: a substrate; a buffer layer on the substrate; a semiconductor layer on the buffer layer, including a source region, a drain region and a channel region; a first gate insulating layer covering the semiconductor layer; a second gate insulating layer foot on the first gate insulating layer, a width of the second gate insulating layer foot being smaller than a width of the first gate insulating layer; and a gate electrode on the second gate insulating layer foot; wherein a part of the first gate insulating layer that is on the semiconductor layer has a flat upper surface. The present application may obtain better implantation profiles of source region and drain region, thereby obtaining better uniformity in TFT performance.

Thin film transistor and active matrix organic light emitting diode assembly and method for manufacturing the same

Methods for fabricating an IGZO layer and fabricating TFT are provided in the present invention. The method for fabricating TFT includes the following steps: (1) depositing an IGZO layer and forming a surface oxidizing gas protective layer on the IGZO layer; (2) coating the IGZO layer with a photoresist, and then subjecting the photoresist to an exposing and developing process to form a photoresist pattern; and (3) subjecting the IGZO layer to an etching process, and then removing the photoresist. By forming an oxidizing gas protective layer, the present methods for fabricating an IGZO layer and fabricating TFT can effectively reduce the effect of hydrogen atom on IGZO layer and avoid the change of IGZO layer from semiconductor to conductor, thereby improving the stability of the IGZO layer and thus the TFT, and reducing the negative bias of threshold voltage generated by the long-term continuous use of the device.

Method for fabricating IGZO layer and TFT

A thin film transistor includes a semiconductor layer including a source region, a drain region, a channel region, first lightly doped drain regions adjacent to the channel region and second lightly doped drain regions adjacent to the first lightly doped drain regions; wherein the second lightly doped drain regions have a doping concentration lower than that of the first lightly doped drain regions. According to the present application, the leakage current in a switching transistor may be further reduced, thereby avoiding instability and even failure in the operation of the assembly caused by overlarge leakage current.

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Shanghai, China

Chia-chi Huang