Nan Ya Technology Corporation

Chia-Chi Hsu

Wu-Der Yang

Jui-Chung Hsu

A die device includes a die including an active layer; and an interconnect feature configured for electrical connection of the active layer, wherein the interconnect feature is in contact with a substrate in the die; and a bump, independent of the die, configured for electrical connection of the active layer.

Housing assembly and memory device

A circuit in probe card, which includes a signal line, a detection probe and a plurality of switch modules. A plurality of test response signals form a plurality of chips to be tested are transmitted on the signal line. The detection probe is coupled to the signal line for receiving the test response signals from the tested chips. In addition, each of the switch modules is respectively coupled to the signal line and the probes to selectively transmit the test response signals from the chips to the signal line such that the chips are able to be tested without disruption caused by an electrical short.

Growing community of inventors

Taoyuan, Taiwan

Chia-Chi Hsu