Taiwan Semiconductor Manufacturing Comp. Ltd.

Hewlett-Packard Development Company, L.p.

Chia-Cheng Lin

Shu-Huei Suen

Yu-Sheng Su

Hung-Jui Chang

Heng-Fu Chang

Jeng-Chang Her

Hsin-Jen Lin

Chao-Shen Chen

In example implementations, an apparatus is provided. The apparatus includes an interface, an integrated graphical processing unit (GPU), a discrete GPU, and a controller. The interface is to receive a connection to an external display device. The integrated GPU and the discrete GPU are communicatively coupled to the interface. The controller is communicatively coupled to the integrated GPU and the discrete GPU and is to deactivate the discrete GPU and activate the integrated GPU in response to detection of the external display device connected to the interface.

Activation of integrated graphical processing units

A method for forming a semiconductor device structure is provided. The method includes providing a wafer having a central portion and a peripheral portion surrounding the central portion. The method includes forming a first dielectric layer over the central portion. The first dielectric layer has first contact openings exposing conductive regions of the wafer. The method includes forming a protective layer over the peripheral portion. The method includes after forming the protective layer, performing a metal silicide process to form metal silicide structures over the conductive regions of the wafer.

Semiconductor device structure and method for forming the same

A wafer pod. The wafer pod comprises a main body, a working sheet holder disposed on the main body, and a lock disposed between the working sheet holder and the main body. The working sheet holder is fixed to the main body by the lock to form an accommodating space.

Wafer pod with working sheet holder

Growing community of inventors

Taipei, Taiwan

Chia-Cheng Lin