Taiwan Semiconductor Manufacturing Comp. Ltd.

Chia-Cheng Ho

Chih-Sheng Chang

Ming-Shiang Lin

Cheng-Yi Peng

Tzu-Chiang Chen

Chih Chieh Yeh

Tsung-Lin Lee

Yu-Chang Jong

Yi-Tang Lin

Yu-Lin Yang

Tzu-Chung Wang

Jin Cai

Tung Ying Lee

Chun-Chieh Lu

Yee-Chia Yeo

Carlos H Diaz

Feng Yuan

Pei-Lun Wang

Hui-Ting Lu

Jyun-Guan Jhou

Ming-Ta Lei

Wei-Sheng Yun

Kai-Tai Chang

Jung-Piao Chiu

Ming Chyi Liu

Tsu-Hsiu Perng

Wei-Jen Lai

Fei-Yun Chen

Kaochao Chen

Chan-Yu Hung

Yen-Ming Chen

Hung-Li Chiang

Dian-Hau Chen

Ming-Feng Shieh

Tung-Ying Lee

Han-Ting Tsai

Chia-Yu Wei

Puo-Yu Chiang

Tzung-Yi Tsai

Tun-Yi Ho

A semiconductor device includes a semiconductor fin, a gate structure, a capacitor structure, a conductive contact, and a hard mask layer. The gate structure is disposed across the semiconductor fin. The capacitor structure is disposed on the gate structure. The capacitor structure includes a ferroelectric layer. The conductive contact is disposed on the capacitor structure. The hard mask layer laterally surrounds the conductive contact. The conductive contact protrudes from a top surface of the hard mask layer.

Semiconductor device and manufacturing method thereof

An integrated chip includes a gate structure overlying a substrate between a source region and a drain region. A field plate is disposed within a first dielectric layer overlying the substrate. The field plate is laterally offset from the gate structure by a non-zero distance in a direction towards the drain region. An isolation structure is disposed within the substrate. The field plate directly overlies at least a portion of the isolation structure.

Field plate and isolation structure for high voltage device

A semiconductor structure is provided. The semiconductor structure includes a substrate, a deep trench isolation (DTI), an interconnect structure, and a conductive pillar. The DTI is disposed in the substrate and the interconnect structure is disposed over the substrate. The conductive pillar extends from the interconnect structure toward the substrate and penetrates the DTI. A method of manufacturing the semiconductor structure is also provided.

Semiconductor structure and method of manufacturing the same

The various described embodiments provide a transistor with a negative capacitance, and a method of creating the same. The transistor includes a gate structure having a ferroelectric layer. The ferroelectric layer is formed by forming a thick ferroelectric film, annealing the ferroelectric film to have a desired phase, and thinning the ferroelectric film to a desired thickness of the ferroelectric layer. This process ensures that the ferroelectric layer will have ferroelectric properties regardless of its thickness.

Transistor with a negative capacitance and a method of creating the same

A ferroelectric semiconductor device and method are described herein. The method includes performing a diffusion anneal process to drive elements of a dopant film through an amorphous silicon layer and into a gate dielectric layer over a fin to form a doped gate dielectric layer with a gradient depth profile of dopant concentrations. The doped gate dielectric layer is crystallized during a post-cap anneal process to form a gradient depth profile of ferroelectric properties within the crystallized gate dielectric layer. A metal gate electrode is formed over the crystallized gate dielectric layer to obtain a ferroelectric transistor with multi-ferroelectric properties between the gate electrode and the channel. The ferroelectric transistor may be used in deep neural network (DNN) applications.

Ferroelectric semiconductor device and method

Various embodiments of the present disclosure are directed towards an integrated chip including a field plate. A gate structure overlies a substrate between a source region and a drain region. A drift region is disposed laterally between the gate structure and the drain region. A first dielectric layer overlies the substrate. A field plate is disposed within the first dielectric layer between the gate structure and the drain region. A conductive wire overlies the first dielectric layer and contacts the field plate. At least a portion of the conductive wire directly overlies a first sidewall of the drift region.

Field plate structure to enhance transistor breakdown voltage

Various embodiments of the present disclosure are directed towards an integrated chip comprising a gate electrode disposed on a substrate between a pair of source/drain regions. A dielectric layer is over the substrate. A field plate is disposed on the dielectric layer and laterally between the gate electrode and a first source/drain region in the pair of source/drain regions. The field plate comprises a first field plate layer and a second field plate layer. The second field plate layer extends along sidewalls and a bottom surface of the first field plate layer. The first and second field plate layers comprise a conductive material.

Field plate structure for high voltage device

A semiconductor device includes a first fin and a second fin in a first direction and aligned in the first direction over a substrate, an isolation insulating layer disposed around lower portions of the first and second fins, a first gate electrode extending in a second direction crossing the first direction and a spacer dummy gate layer, and a source/drain epitaxial layer in a source/drain space in the first fin. The source/drain epitaxial layer is adjacent to the first gate electrode and the spacer dummy gate layer with gate sidewall spacers disposed therebetween, and the spacer dummy gate layer includes one selected from the group consisting of silicon nitride, silicon oxynitride, silicon carbon nitride, and silicon carbon oxynitride.

Semiconductor device with fin end spacer dummy gate and method of manufacturing the same

The present disclosure describes a structure with a conductive plate and a method for forming the structure. The structure includes a gate structure disposed on a diffusion region of a substrate, a protective layer in contact with the diffusion region and covering a sidewall of the gate structure and a portion of a top surface of the gate structure, and a first insulating layer in contact with the gate structure and the protective layer. The structure further includes a conductive plate in contact with the first insulating layer, where a first portion of the conductive plate laterally extends over a horizontal portion of the protective layer, and where a second portion of the conductive plate extends over a sidewall portion of the protective layer covering the sidewall of the gate structure. The structure further includes a second insulating layer in contact with the conductive plate.

Strained transistor with conductive plate

A method includes forming a dummy pattern over test region of a substrate; forming an interlayer dielectric (ILD) layer laterally surrounding the dummy pattern; removing the dummy pattern to form an opening; forming a dielectric layer in the opening; performing a first testing process on the dielectric layer; performing an annealing process to the dielectric layer; and performing a second testing process on the annealed dielectric layer.

Semiconductor structure and testing method thereof

A semiconductor test device for measuring a contact resistance includes: first fin structures, upper portions of the first fin structures protruding from an isolation insulating layer; epitaxial layers formed on the upper portions of the first fin structures, respectively; first conductive layers formed on the epitaxial layers, respectively; a first contact layer disposed on the first conductive layers at a first point; a second contact layer disposed on the first conductive layers at a second point apart from the first point; a first pad coupled to the first contact layer via a first wiring; and a second pad coupled to the second contact layer via a second wiring. The semiconductor test device is configured to measure the contact resistance between the first contact layer and the first fin structures by applying a current between the first pad and the second pad.

Semiconductor test device and manufacturing method thereof

Semiconductor device with Fin end spacer dummy gate and method of manufacturing the same

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Hsinchu, Taiwan

Chia-Cheng Ho