Taiwan Semiconductor Manufacturing Comp. Ltd.

Advanced Optoelectronic Technology, Inc.

Industrial Technology Research Institute

Epistar Corporation

Chia-Chen Chang

Yun-Chi Wu

Chih-Yung Lin

Cheng-Bo Shu

Chen Ou

Tsu-Hsiu Perng

Pei-Lun Wang

Jyun-Guan Jhou

Chia-Ming Chuang

Yuan-Cheng Yang

Donald Tai-Chan Huo

Tzu-Ling Yang

Yu-Chee Tseng

Min-Tsun Hsieh

Ching-Lien Yeh

Cheng-Tai Chen

Shih-Jung Tu

Pei-Chuan Tsai

Yi-Chang Liu

Lien-Wu Chen

Ching-Fang Lu

Yi-Chen Liu

Yin-Chih Lu

Tsu-hsiu Perng

Chuan-Fu Yang

Shih-Ya Chen

Erh-Fang Lee

Yuan-Mou Dai

Yue-Zhi Chen

A method includes: etching a trench on a surface of a substrate; filling the trench with a dielectric material to form a first isolation region; depositing a patterned mask layer on the substrate, the patterned mask layer comprising an opening exposing the substrate; implanting oxygen into the substrate through the opening to form an implant region; generating a second isolation region from the implant region; and forming a transistor on the substrate. The transistor includes a channel laterally surrounding the second isolation region.

Method of forming high voltage transistor and structure resulting therefrom

A method for making a semiconductor device includes forming a ROX layer on a substrate and a patterned silicon oxynitride layer on the patterned ROX layer; conformally forming a dielectric oxide layer to cover the substrate, the patterned silicon oxynitride layer, and the patterned ROX layer; and fully oxidizing the patterned silicon oxynitride layer to form a fully oxidized gate oxide layer on the substrate.

Semiconductor device having fully oxidized gate oxide layer and method for making the same

A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a first isolation structure which has a first corner. The semiconductor device also includes a first well region with a first conductive type. The semiconductor device includes further includes a gate structure over the first well region and covers a portion of the first corner of the first isolation structure. In addition, the semiconductor device includes a first doped region and a second doped region disposed on two opposites of the gate structure. Each of the first doped region and the second doped region has the first conductive type. The semiconductor device also includes a first counter-doped region in the first well region with a second conductive type different from the first conductive type. The first counter-doped region covers the first corner of the first isolation structure.

Semiconductor device and method of manufacturing the same

A method of detecting a biological sample includes the following steps. A magnetic sensor chip is provided, wherein the magnetic sensor chip includes a substrate and a magnetic sensing layer located on the substrate. Probes are connected to the magnetic sensor chip. A sample solution containing biological samples labeled with a first marker is provided on the magnetic sensor chip, so that the biological samples labeled with the first marker are hybridized with the probes. Magnetic beads labeled with a second marker are provided on the magnetic sensor chip, so that the magnetic beads labeled with the second marker are bound onto the biological samples labeled with the first marker. A signal sensed by the magnetic sensing layer is detected by a magnetic sensor.

Method of detecting biological sample

A method for vehicle positioning is provided, which includes the steps of identifying at least one vehicle in an image, obtaining identification information of each vehicle from the image, and transforming coordinates of each vehicle in the image into positioning information of the corresponding vehicle according to mapping information. The positioning information is a position of the corresponding vehicle in real world. Precise lane-level vehicle positioning can be achieved based on comparison with the identification information or the positioning information.

Apparatus and method for vehicle positioning

This invention provides a high-efficiency light-emitting device and the manufacturing method thereof The high-efficiency light-emitting device includes a substrate; a reflective layer; a bonding layer; a first semiconductor layer; an active layer; and a second semiconductor layer formed on the active layer. The second semiconductor layer includes a first surface having a first lower region and a first higher region.

High-efficiency light-emitting device and manufacturing method thereof

An LED bulb includes a bulb body and an adapter detachably connecting with the bulb body. The bulb body has two pins function as a negative electrode and a positive electrode. The two pins are for inserting into and electrically connecting with a bi-pin socket connector for light bulb, such as MR16 socket connector. The adapter includes a junction seat, a first connector, a second connector, and a bulb cap. Metallic threads are formed on the bulb cap. The first connector is received in the junction seat and electrically contacts the threads. The second connector extends through the junction seat and the bulb cap to make a bottom end thereof being exposed. The adapter is able to engage and electrically connect with an Edison screw socket connector, for example, E-10 socket connector.

LED bulb capable of mating with light bulb sockets having different configurations

LED bulb

This invention provides a high-efficiency light-emitting device and the manufacturing method thereof. The high-efficiency light-emitting device includes a substrate; a reflective layer; a bonding layer; a first semiconductor layer; an active layer; and a second semiconductor layer formed on the active layer. The second semiconductor layer includes a first surface having a first lower region and a first higher region.

A cleaner and method for removing excess residual cleaning fluid from an object, particularly a semiconductor wafer, before or as the wafer is removed from a cleaning chamber of a CMP cleaner, for example. Typically, a purge bar is mounted on each side of the cleaning chamber for blowing nitrogen or clean, dry air (CDA) against a corresponding surface of the wafer to remove the excess cleaning fluid from the wafer. The purge bars may be connected to a controller for a wafer transfer device which removes the wafer from the cleaning chamber, such that the purge bars are actuated as the wafer transfer device begins to remove the wafer from the chamber.

Cleaner and method for removing fluid from an object

Growing community of inventors

Hsinchu, Taiwan

Chia-Chen Chang