Mpi Corporation

Chia-An Yu

Hao Wei

Chia-Nan Chou

Yu-Hao Chen

Ming-Hsiang Hsieh

Chien-Chiao Chen

Chia-Jung Liu

A probe assembly, adapted to test high-speed signal transmission lines of printed circuit boards, includes two pogo pins for providing high-frequency differential test signals, and both sides of the pogo pin include no metal layer (grounding layer). Experiments have found that when the two pogo pins test a to-be-tested object, the test signal will be coupled to the metal layers on both sides of the pogo pins to generate a radiation resonance, resulting in a loss of the test signal on a specific frequency band, and further reducing the effective bandwidth of the probe assembly. The metal layers on both sides of the pogo pins of the probe assembly are reduced, so that the foregoing radiation resonance phenomenon can be avoided.

Probe assembly

A probe card includes a printed circuit board (PCB), a connection substrate electrically connected with the PCB, a probe head, and a signal path switching module disposed on a lateral periphery surface or a bottom surface of the connection substrate, electrically connected with probe needles of the probe head and the connection substrate and including first and second circuit lines with first and second inductors respectively, and a capacitor electrically connected between the first and second circuit lines. A test signal from a tester is transmitted between the tester and a device under test (DUT) via the PCB, the connection substrate, the first and second circuit lines and the probe needles. A loopback test signal from the DUT is transmitted back to the DUT via the probe needles, parts of the first and second circuit lines and the capacitor.

Probe card and signal path switching module assembly

Growing community of inventors

Chu-Pei, Taiwan

Chia-An Yu