Cheil Industries Inc.

Chi-Won An

Woo-Han Kim

Eun-Seon Lee

Ha-Neul Kim

Sang-Ran Koh

Hong-Jung Yoo

Young-Ho Kim

Dong-il Han

Dong-Ju Shin

Chang-Soo Woo

Doo-Ri Song

Yun-Hee Baek

Yong-Kook Kim

Disclosed are a curable polysiloxane composition for an optical device includes at least one of a first siloxane compound represented by the following Chemical Formula 1, at least one of a second siloxane compound having silicon-bonded hydrogen (Si&#x2014;H) at the terminal end, and at least one of a third siloxane compound having a silicon-bonded alkenyl group (Si-Vi) at the terminal end, an encapsulant obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulant.(RRRSiO)(RRSiO)(RRSiO)(RSiO&#x2014;Y&#x2014;SiOR)(RSiO)(RSiO)(RSiO)(SiO&#x2014;Y&#x2014;SiO)(SiO)&#x2003;&#x2003;[Chemical Formula 1] In the above Chemical Formula 1, Rto R, Y, Y, M1, D1, D2, D3, T1, T2, T3, T4 and Q1 are the same as defined in the specification.

Curable polysiloxane composition for optical device and encapsulant and optical device

A siloxane monomer obtained from a compound represented by Chemical Formula 1 and a compound represented by Chemical Formula 2, an encapsulant composition including the siloxane monomer, an encapsulant obtained by curing the encapsulant composition, and an electronic device including the encapsulant are disclosed.

Siloxane monomer, encapsulant composition, encapsulant and electronic device

Disclosed are a composition for an encapsulant that includes a first polysiloxane including a moiety represented by Chemical Formula 1 and an alkenyl group bound to silicon (Si&#x2014;Vi) at the terminal end and a second polysiloxane including hydrogen bound to silicon (Si&#x2014;H) at the terminal end, an encapsulant obtained by curing the composition for an encapsulant, and an electronic element including the encapsulant.

Composition for encapsulant, encapsulant, and electronic element

A composition for an encapsulant, an encapsulant, and an electronic device, the composition including an adhesion-promoting agent, the adhesion-promoting agent including an epoxy group in an amount of about 2.0 to about 5.0 mmol/g, at least one first polysiloxane that includes a hydrogen bound to a silicon at a terminal end thereof, and at least one second polysiloxane that includes an alkenyl group bound to a silicon at a terminal end thereof.

Composition for encapsulant, encapsulant, and electronic device

Growing community of inventors

Suwon-si, South Korea

Chi-Won An