Samsung Electronics Co., Ltd.

Chi-Weon Yoon

Dae-seok Byeon

Sang-Wan Nam

Hyun-Kook Park

Yeong-taek Lee

Jae-Yong Jeong

Yong-Kyu Lee

Sung-won Yun

Hyo-Jin Kwon

Heung-Soo Lim

Kee-Ho Jung

Dong-Hun Kwak

Doo-hyun Kim

Dong-Hyuk Chae

Jin-Young Chun

Kyung-Hwa Kang

Jae-phil Kong

Dae-Seok Byeon

Ji-Hyun Park

Moo-sung Kim

Bo-Geun Kim

Jung-Yun Yun

June-Hong Park

Jung-hoon Park

Su-Yong Kim

Jong-Yeol Park

Chae-Hoon Kim

In-Mo Kim

Gyo-Soo Choo

Hae-Suk Shin

A nonvolatile memory device includes a memory cell region, a peripheral circuit region, a memory block in the memory cell region, and a control circuit in the peripheral circuit region. The memory cell region includes a first metal pad. The peripheral circuit region includes a second metal pad and is vertically connected to the memory cell region by the first metal pad and the second metal pad. The memory block includes a plurality of memory cells disposed in a vertical direction. The control circuit applies an erase voltage to an erase source terminal of the memory block, and applies a first voltage to a first selection line among a plurality of selection lines in the memory block. The first voltage is higher than the erase voltage. The first selection line is disposed closest to the erase source terminal among the plurality of selection lines and is used for selecting the memory block as an erase target block.

Methods of erasing data in nonvolatile memory devices and nonvolatile memory devices performing the same

A method of operating a nonvolatile memory device includes erasing data within a NAND string of memory cells within the memory device by applying a non-zero erase voltage to a source/drain terminal at a first end of the NAND string. This erase voltage is applied concurrently with establishing gate-induced drain leakage (GIDL) in a pair of selection transistors within the NAND string. This GIDL can occur by applying unequal and non-zero first and second voltages to respective first and second gate terminals of the pair of selection transistors. The selection transistors can be string selection transistors or ground selection transistors.

A voltage generator of a nonvolatile memory device includes a charging circuit, a current mirror circuit, a discharging circuit and an output circuit. The charging circuit amplifies a difference between a reference voltage and a feedback voltage to generate a first current. The current mirror circuit is connected to the charging circuit and generates a second current based on the first current. The discharging circuit is connected to the current mirror circuit to draw the second current, and discharges the output voltage to a target level by adjusting discharging amount of the second current based on a sensing voltage which reflects a change of the feedback voltage. The output circuit is connected to the current mirror circuit, and provides the output voltage based on the first current and the second current to a first word-line connected to an output node.

Voltage generator for a nonvolatile memory device, and a method of operating the voltage generator

A method of controlling the operation of a memory controller includes, in a read operation of a non-volatile memory device, the memory controller counting a selected read count of a selected string in a selected memory block and/or counting a non-selected read count of a non-selected string in the selected memory block. The memory controller performs a reclaim operation of the selected memory block when the selected read count and/or the non-selected read count exceeds a read threshold. To move data of the selected memory block to another memory block by the reclaim operation, the memory controller may copy the data of the selected memory block to another block by using a changed page address.

Memory controller having reclaim controller and method of controlling operation of the memory controller

Provided are a nonvolatile memory device and a method of performing a sensing operation on the nonvolatile memory device. The nonvolatile memory device includes a control logic coupled to a memory cell array including strings. The control logic is configured to control a first weak-on voltage applied to an unselected string selection line and a second weak-on voltage applied to an unselected ground selection line during a setup interval of the sensing operation for sensing data from a selected string. The unselected string selection line and ground selection line are connected to a string selection transistor and a ground selection transistor, respectively, of a same unselected string. The selected string and the unselected string are connected to a same bit line. The first weak-on voltage and second weak-on voltage are respectively less than a threshold voltage of the string selection transistor and the ground selection transistor in the unselected string.

Nonvolatile memory device and method of reading the same

A memory device is provided as follows. A memory cell region includes a plurality of blocks, each block including a plurality of NAND strings. A control logic divides the plurality of blocks into a plurality of block regions based on a smaller distance of a first distance with respect to a first edge of the memory cell region and a second distance with respect to a second edge of the memory cell region and controls an operation performed on the memory cell region using a plurality of bias sets of operation parameters for the operation. Each bias set is associated with one of the block regions.

Memory device, memory system and method of operating memory device

A method of operating a resistive memory device having a plurality of word lines and a plurality of bit lines includes selecting one or more first memory cells connected to a first bit line, selecting one or more second memory cells connected to a second bit line, and simultaneously performing a reset write operation on the first and second memory cells using a first write driver.

Resistive memory device, resistive memory system, and method of operating resistive memory device

A resistive memory device includes a column decoder having a first switch unit, including at least one pair of switches arranged in correspondence to each of a plurality of signal lines, and a second switch unit including a pair of switches arranged in correspondence to the at least one pair of switches of the first switch unit. A first pair of switches of the first switch unit includes a first switch and a second switch that are of the same type, and a second pair of switches of the second switch unit includes a third switch and a fourth switch that are connected to the first pair of switches. A selection voltage is provided to the first signal line by passing through the first switch, and an inhibit voltage is provided to the first signal line by selectively passing through the first switch or the second switch.

Resistive memory device including column decoder and method of performing a bidirectional driving operation and providing appropriate biasing with respect to bit lines

A memory device includes a memory cell array having multiple memory cells arranged respectively in regions where first signal lines cross second signal lines. The memory device further includes a decoder having multiple line selection switch units connected respectively to the of first signal lines. Each of the multiple line selection switch units applies a bias voltage to a first signal line corresponding to each of the multiple line selection switch units in response selectively to a first switching signal and a second switching signal, voltage levels of which are different from each other in activated states.

Resistive memory device and method of operating the same

A resistive memory device includes a memory cell array that includes a plurality of memory layers stacked in a vertical direction. Each of the plurality of memory layers includes a plurality of memory cells disposed in regions where a plurality of first lines and a plurality of second lines cross each other. A bad region management unit defines as a bad region a first memory layer including a bad cell from among the plurality of memory cells and at least one second memory layer.

Resistive memory device having memory cell arrays with multiple stack layers and bad-region managing circuit and method for managing short failure

A method of operating a memory device includes; applying a pre-write voltage to a selected memory cell by applying a first voltage to a first signal line connected to the selected memory cell and a second voltage to a second signal line connected to the selected memory cell during a first set writing interval, wherein a level of the first voltage is higher than a level of the second voltage, and thereafter, applying a write voltage to the selected memory cell by applying a third voltage having a level lower than the level of the first voltage and higher than the level of the second voltage to the first signal line during a second set writing interval.

Resistive memory device and operating method

A method of operating a memory device, which includes of memory cells respectively arranged in regions where first signal lines and second lines cross each other, includes determining a plurality of pulses so that each of the plurality of pulses that are sequentially applied to a selected memory cell among the plurality of memory cells is changed according to a number of times of executing programming loops. In response to the change of the plurality of pulses, at least one of a first inhibit voltage and a second inhibit voltage is determined so that a voltage level of at least one of the first and second inhibit voltages that are respectively applied to unselected first and second signal lines connected to unselected memory cells among the plurality of memory cells is changed according to the number of times of executing the programming loops.

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Seoul, South Korea

Chi-Weon Yoon