Compal Electronics, Inc.

Chi-Wei Tien

Chang-Yuan Wu

Jenq-Haur Pan

Wei-Chung Hsiao

Hui-Lian Chang

Chien-Ming Su

Ching-Ya Tu

Chun-Hung Huang

Hsuan-Cheng Wang

Min-Yuan Lin

Wen-Yu Wu

Chau-Wen Cheng

Ya-Ping Lin

Sheng-Liang Cheng

Chih-Wei Cheng

A heat pipe structure including a pipe body and a working substance is provided. The pipe body has two closed ends opposite to each other, an inner surface, a compressed portion, and an expanded portion. The inner surface and the two closed ends form a cavity. The compressed portion includes a plurality of first grooves formed at the inner surface. Any one of the first grooves includes a first width. The expanded portion includes a plurality of second grooves formed at the inner surface. Any one of the second grooves includes a second width, and the first width is approximately equal to the second width. The working substance is contained in the cavity.

Heat pipe structure and flattened heat pipe structure

A fan assembly for use in an electronic device is provided. The fan assembly includes a housing, a fan, a throttle valve, and a regulator. The housing has an outlet. The fan is disposed in the housing and adapted to provide an air current. The air current generates an air volume through the outlet. The throttle valve is movably disposed in the housing at the outlet. The regulator is connected to the throttle valve to control the movement of the throttle valve to adjust the size of the outlet.

Fan assembly

A thermal module suitable for cooling a heat generating element within a casing of an electronic apparatus includes a fan, a heat sink and a heat pipe. The fan is mounted within the casing for generating airflow to an opening of the casing. The heat sink is mounted within the casing between the opening of the casing and the fan, such that the airflow generated by the fan passes through the heat sink and then flows out of the opening. The heat pipe contacts the heat generating element, extends from the heat generating element to the heat sink, and extends along a periphery of the fan to contact the heat generating element again.

Thermal module and electronic apparatus using the same

A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.

Thermal conducting medium protector

The present invention relates to a method for auto-regulating the fan speed. The method includes detecting the temperature of a thermal source. When the temperature of the thermal source exceeds a target value, the fan speed of the fan is regulated according to a relation between the temperature of the thermal source and the fan speed of the fan. Thereafter, the voltage applied to the fan is micro-adjusted through a feedback control mechanism so that the fan speed of the fan reaches a specified speed in steps.

Method for auto-regulating fan speed

A heat dissipation structure configured to couple with an interface card is provided. The heat dissipation structure comprises a first heat conduction portion arranged above a first surface of a wired board of the interface card, a second heat conduction portion arranged above a second surface of the wired board opposite the first surface thereof, and a heat convection portion connecting the first and the second heat conduction portions. Both the first and the second heat conduction portions comprise a plurality of contact leads used to contact the heat-generating electronic components disposed on the two surfaces of the wired board. The heat convection portion has a plurality of first bending strips and a plurality of second bending strips that are alternatively arranged, and a plurality of heat convection slots are formed between the first bending strips and the second bending strips.

Heat dissipation structure for interface card

A method for controlling a fan is provided for adjusting the rotational speed of a fan. The method includes adjusting the rotational speed of the fan from a first mode value to a range of rotational speed variation, wherein the upper bound of the range of rotational speed variation is a second mode value plus a first variation value, and the lower bound of the range of rotational speed variation is the second mode value minus a second variation value; and adjusting the rotational speed of the fan in the range of rotational speed variation during a time period. Thus, a user will not consider the sound from the fan as a noise.

Method for controlling fan

A heat dissipating device comprises a dust-collecting mechanism installed at the air vent passage of a fan, and thus the dust or particles mixed in the airflow of the fan shall be collected on the top of the dust-collecting mechanism; the dust-collecting mechanism can be taken out frequently to remove and clean the collected dust or particles, so that the airflow of the fan can be kept normal and the dust deposited on the surface of the metal fins of a heat sink can be decreased greatly as to normally maximize the heat dissipating efficiency for the heat dissipating device for a long period of time and maintain the heat generating source to operate normally at a permissible temperature.

Growing community of inventors

Taipei, Taiwan

Chi-Wei Tien