Xiamen Sanan Optoelectronics Technology Co., Ltd.

Quanzhou Sanan Semiconductor Technology Co., Ltd.

Quanzhou Sanan Semiconductor Technoogy Co., Ltd.

Chi-Wei Liao

Chen-Ke Hsu

Junpeng Shi

Weng-Tack Wong

Yanqiu Liao

Zheng Wu

Changchin Yu

Shuning Xin

Aihua Cao

Chih-Wei Chao

Chia-En Lee

Zhen-Duan Lin

Hui Chen

Xinglong Li

Chen-ke Hsu

Zhen-duan Lin

Chia-en Lee

Xing-Long Li

Weng Tack Wong

A light-emitting diode (LED) packaging module includes a plurality of LED chips spaced apart from one another, an encapsulating layer that fills in a space among the LED chips, a light-transmitting layer disposed on the encapsulating layer, a wiring assembly disposed on and electrically connected to the LED chips, and an insulation component that covers the encapsulating layer and the wiring assembly. Each of the LED chips includes an electrode assembly including first and second electrodes. The light-transmitting layer includes a light-transmitting layer that has a light transmittance greater than that of the encapsulating layer.

Light-emitting diode packaging module

A light-emitting device includes a number (N) of light-emitting units, a number (a) of first metal pads and a number (b) of second metal pads. Each of the light-emitting units includes a number (n) of light-emitting chips each having two distinct terminals, where N and n are integers and N>1, n>≥3. The numbers (a) and (b) are integers and a>1, b>1, and the terminals of each of the light-emitting chips are electrically connected to a unique combination of one of the number (a) of first metal pads and a number (b) of second metal pads, respectively. The numbers (N), (n), (a) and (b) satisfy the equation: a*b=n*N.

Light-emitting device and display screen including the same

A light-emitting diode (LED) packaging module includes light-emitting units arranged in an array having m row(s) and n column(s), an encapsulating layer, and a wiring assembly, where m and n each independently represents a positive integer. Each of the light-emitting units includes LED chips each including a chip first surface, a chip second surface, a chip side surface, and an electrode assembly disposed on the chip second surface. The encapsulating layer covers the chip side surface and fills a space among the LED chips. The wiring assembly is disposed on the chip second surface and is electrically connected to the electrode assembly.

Light-emitting diode packaging module having encapsulated array of LED chips

The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.

Laser device and light guide member used with the same

A light-emitting diode (LED) packaging module includes LED chips, a wiring layer, and an encapsulant component. Each of the LED chips includes a chip first surface, a chip second surface, a chip side surface, and an electrode unit. The wiring layer is disposed on the chip second surfaces of the LED chips, and contacts and is electrically connected to the electrode units. The encapsulant component includes a first encapsulating layer that covers the chip side surface, and a second encapsulating layer that covers the wiring layer. The LED chip has a thickness T, the first encapsulating layer has a thickness T, in which T/T≥1.

A light-emitting diode (LED) includes: a base having an upward-opening accommodating space; an LED chip disposed at the base, and arranged in the accommodating space; a packaging adhesive covering the LED chip; a lens disposed over the packaging adhesive, wherein: the lens has a first surface proximal to the packaging adhesive; the first surface has: a first subsurface at a center area with a substantially spherical or parabolic shape; a second subsurface with a substantially ring shape and surrounding the first subsurface and extending downward with an increasing diameter; a third subsurface with a substantially ring shape and surrounding the second subsurface, having a top ring edge and extending downward with a decreasing diameter; and a fourth subsurface with a substantially planar shape and surrounding the top ring edge of the third subsurface and connected with the base.

LED device

Growing community of inventors

Xiamen, China

Chi-Wei Liao