Asm Technology Singapore Pte Ltd

Asm Assembly Automation Limited

Asmpt Singapore Pte. Ltd.

Chi Wah Cheng

Yu Sze Cheung

Kai Fung Lau

Lap Kei Chow

Lap Kei Eric Chow

Tim Wai Tony Mak

Hoi Shuen Tang

Chi Hang Leung

Wang Lung Alan Tse

Wang Lung Tse

Wan Yin Yau

Shing Kai Yip

Chi Fung Chan

Hoi Shuen Joseph Tang

Ping Chun Benson Chong

Chiu Fai Wong

Man Kit Mui

Hing Suen Siu

Hon Kam Ng

Ka On Yue

Chi Hang Kwok

See Lok Chan

Chun Kit Liu

Ping Kong Joseph Choy

Chung Yan Lau

Hoi Fung Tsang

Yui Ko Wong

Kwok Pun Law

Ka Kin Wong

Leung Por Chan

Hon Keung Lai

Hon Kam Boris Ng

Tim Wai Mak

Chi Hung Leung

Leung Por Boris Chan

Chin Pang Anson Chan

Chin Pang Chan

Chi Kit Cheung

Ping Chun Chong

Kai Chiu Adam Wu

Ka On Alfred Yue

Cho Tao Cheung

Chi Yat Yeung

Man Kin Leung

Alfred Ka On Yue

Eric Lap Kei Chow

Zhuanyun Zhang

Joseph Hoi Shuen Tang

Sze Leong Lai

Hei Lam Chang

Ming Cheong Kary Tse

A die ejection apparatus operable to eject a die from a support has at least two ejector components configured to lift a die located on the support. The ejector components are moveable to a position in which a lifting force is exertable by the ejector components on the support, so as to lift a die located on the support. Movement of the die ejector components is initiated towards the support, and a moment when each of the die ejector components reaches the position is determined. A height offset of each die ejector component relative to a height of another die ejector component is determined upon reaching the said position, and relative heights of the die ejector components are adjusted in dependence upon the evaluated height offset.

Die ejector height adjustment

A test handler comprising a primary rotary turret comprising pick heads for transporting electronic components, and a secondary rotary turret arranged and configured to receive electronic components directly or indirectly from the primary rotary turret, the secondary rotary turret including multiple separate test sectors having component carriers for carrying the electronic components received from the primary rotary turret, wherein the multiple test sectors are rotatably movable relative to one another. The test handler also comprises at least one testing device positioned along a periphery of the secondary rotary turret, wherein the component carriers of the respective test sectors are operative to convey the electronic components to a position of the at least one testing device for testing.

Test handler having multiple testing sectors

An apparatus and a method for dispensing a viscous adhesive for attaching a semiconductor die onto a substrate are provided, where the method comprises the steps of dispensing a volume of viscous adhesive from a nozzle onto the substrate and moving the nozzle away from the substrate such that an adhesive tail is formed between the nozzle and the volume of viscous adhesive. The method further comprises the steps of capturing multiple images of the adhesive tail with an imaging device as the nozzle is moving away from the substrate with an imaging device; and thereafter detecting with the imaging device an instant when the adhesive tail breaks from the volume of viscous adhesive.

Apparatus and method for dispensing a viscous adhesive

An adhesive dispenser for a die bonding apparatus has an adhesive dispenser head configured to dispense adhesive onto bonding pads of a substrate, and a head conveyer configured to convey the adhesive dispenser head along orthogonal first and second axes for dispensing the adhesive onto target dispensing positions on the bonding pads. The head conveyor includes a first linear positioning motor operative to convey the adhesive dispenser head along the first axis and a rotary positioning motor coupled to the first linear positioning motor which is operative to rotate the adhesive dispenser head. The rotary positioning motor is configured to cooperate with the first linear positioning motor to convey the adhesive dispenser head along the second axis to the target dispensing positions.

Die bonder incorporating rotatable adhesive dispenser head

A testing apparatus and a method for testing electronic devices is provided. The apparatus comprising a plurality of detachably mountable test stations which are operative to perform tests on the electronic devices and a plurality of pick heads for conveying the electronic devices to at least one of the plurality of test stations for testing. The apparatus further comprises an identification element incorporated in each test station indicating a characteristic of the test station, and an identification element detector movable relative to the plurality of test stations, the identification element detector being operative to identify and authenticate the characteristic of the at least one test station by detecting the identification element incorporated in the test station, prior to utilizing the test station for testing the electronic devices.

Apparatus and method for authentication of electronic device test stations

An apparatus for placing ultra-small electronic devices into pockets on a carrier tape for packing has at least one holding element, a movement mechanism, a conveying mechanism and a positioning mechanism. The positioning mechanism further includes first and second positioning devices coupled to the conveying mechanism, wherein the second positioning device is mounted on the first positioning device. In use, the conveying mechanism conveys the carrier tape to move each pocket to a receiving position and the movement mechanism moves each holding element to place the electronic device into a respective pocket at the receiving position. The positioning mechanism adjusts a relative position between the electronic device and the respective pocket by adjusting the carrier tape, the first and second positioning devices being for coarse and fine positioning of the conveying mechanism respectively.

Apparatus for packing ultra-small electronic devices

A method for automated alignment between a plurality of electronic components and at least one testing device for receiving the electronic components for testing which includes defining a fiducial marker and positioning a moveable imaging device relative to a stationary imaging device, such that the fiducial marker is within a field of view of the moveable imaging device and within a field of view of the stationary imaging device. The moveable imaging device determines, with respect to each of the at least one testing device, a first offset between the testing device and the fidicual marker. The stationary imaging device determines, with respect to each electronic component, a second offset between the electronic component and the fidicual marker. Alignment is effected between each electronic component and the testing device in accordance with the first and second offsets.

Method and apparatus for aligning electronic components

A method for automated alignment of electronic components with respect to one or more inspection devices for inspecting the electronic components, each electronic component having a plurality of side surfaces. The method comprises: positioning each electronic component relative to an imaging device; determining, by the imaging device, an angular offset and a linear offset between each side surface of the electronic component and the one or more inspection devices; positioning each electronic component relative to the inspection devices; effecting alignment between each side surface and the one or more inspection devices in accordance with the respective angular and linear offsets; and inspecting each side surface after effecting alignment between the side surface and the inspection devices.

Method and apparatus for aligning and inspecting electronic components

Disclosed is an apparatus for handling electronic components and a method of adjusting the position of at least one handling device of an apparatus for handling electronic components. The apparatus comprises a rotary device; an imaging device located on the rotary device which is positionable by the rotary device; a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; a fiducial mark located at a fixed position relative to the rotary device such that the rotary device is rotatable relative to the fiducial mark, the fixed position of the fiducial mark being indicative of an arrangement of an electronic component which is held by a respective pick head; and at least one handling device for handling the electronic components, the position of the at least one handling device being adjustable for aligning the at least one handling device with the arrangement of the electronic component held by the pick head; wherein the imaging device is operative to capture at least one image comprising the fiducial mark and the at least one handling device for deriving an offset between the at least one handling device and the arrangement of the electronic component as indicated by the fixed position of the fiducial mark.

Apparatus and method for adjustment of a handling device for handling electronic components

The present invention relates to an apparatus for transferring electronic devices from a holding unit to a processing station. The apparatus comprises first and second rotating mechanisms having a plurality of handlers and a plurality of holders respectively, an imaging mechanism, a processor and an adjusting mechanism. In use, a handler retrieves an electronic device from the holding unit and moves the device to a transfer position. A holder retrieves the electronic device from the handler at the transfer position and transfers the electronic device to the processing station. Prior to this retrieval, the adjusting mechanism adjusts a relative position between the holder and the handler at the transfer position. This adjustment is based on offsets calculated by the processor using images of the handler and holder captured by the imaging mechanism. The adjustment allows the electronic device to be retrieved more securely by the holder.

Apparatus and method for transferring electronic devices

A feeding apparatus for supplying electronic devices for pick-up comprises a guide track for guiding and feeding a plurality of electronic devices and a separator operative to receive electronic devices from the guide track for the electronic devices to be picked up from the separator. A protrusion is located on either of the guide track or the separator, and a cavity is located on the other of the guide track or the separator for receiving the protrusion. The protrusion and the cavity cooperate to form a substantially continuous surface for transferring the electronic devices to the separator.

Electronic device separator for a feeding apparatus

A test handler comprises an orientation changing device having a device holder for holding electronic devices, the device holder having a vertical rotary axis. A conveying device is operative to convey electronic devices to the device holder, and a rotary motor connected to the device holder is operative to rotate the device holder about the vertical rotary axis to change an orientation of the electronic device held on it. A rotary turret of the test handler has a plurality of pick heads arranged on the rotary turret, and each pick head is configured to pick up electronic devices from the device holder.

Test handler that picks up electronic devices for testing and an orientation-changing apparatus for use in a test handler

An apparatus for conveying electronic devices comprises a track for conveying a plurality of electronic devices in a row towards a pick-up position on the track where the electronic devices are removed by a pick-up device. A guiding portion located over the track has a first restraining mechanism formed in the guiding portion that is operative to restrain and secure a first electronic device at a first position next to the pick-up position and a second restraining mechanism formed in the guiding portion that is operative to restrain and secure a second electronic device at a second position away from the pick-up position which is immediately subsequent to the first position. The first and second electronic devices are configured to be released and conveyed towards the pick-up position when the first and second restraining mechanisms respectively are deactivated. A corresponding method is also provided.

A handling system for testing electronic components comprises a rotary turret and pick heads mounted on the rotary turret, each pick head being configured to hold a respective electronic component provided by a supply source. A carrier system which is positionable adjacent to the rotary turret is configured to carry a plurality of electronic components. The carrier system is receivable by a testing station that is operative to simultaneously test a plurality of the electronic components which have been arranged on the carrier system. The pick heads or other transfer mechanism may transfer the electronic components onto the carrier system prior to testing the same at the testing station and remove electronic components from the carrier system after testing the same at the testing station.

Handling system for testing electronic components

A singulation apparatus and method including: at least one chuck station to which a workpiece is securable, the at least one chuck station being configured to move along a feed direction; a bridge extending above the at least one chuck station, the bridge having a first side and a second side opposite the first side; a first cutting device with members mounted to the bridge and being independently movable along the first side, transversely to the feed direction; and a second cutting device with members mounted to the bridge and being independently movable along the second side, transversely to the feed direction, the first and second cutting devices being configured and arranged for cutting the workpiece.

Singulation apparatus and method

Growing community of inventors

Hong Kong, China

Chi Wah Cheng