Taiwan Semiconductor Manufacturing Comp. Ltd.

Chi-Ting Cheng

Cheng-Hung Lee

Jhon-Jhy Liaw

Yen-Huei Chen

Hung-Jen Liao

Jonathan Tsung-Yung Chang

Yu-Hao Hsu

Wei-Jer Hsieh

Chia-Chen Kuo

Chen-Hui Hsieh

Che-Ju Yeh

Hua-Hsin Yu

Yang-Syu Lin

A device disclosed includes first and second rows of memory cells, a first data line, and a first continuous data line. The first and second rows of memory cells are arranged in a first sub-bank and a second sub-bank, separated from the first sub-bank, respectively. The first data line is arranged across the first sub-bank and coupled to a first memory cell in the first row of memory cells. The first continuous data line includes a first portion arranged across the first sub-bank and a second portion arranged across the second sub-bank. The first continuous data line is coupled to a second memory cell in the second row of memory cells. The first portion of the first continuous data line is disposed in a first metal layer. The first data line and the second portion of the first continuous data line are in a second metal layer.

Memory device with strap cells

A power management circuit suitable for a memory device and a memory device is provided. The power management circuit includes a first logic circuit, a second logic circuit, and a transmission gate. The first logic circuit is configured to receive an inverted first input signal and a second input signal and generates a first output signal. The second logic circuit is configured to receive a first input signal and the second input signal and generates a second output signal. The transmission gate is configured to receive the first output signal and generates a control signal to at least one power transistor coupled between the power management circuit and the memory device. During a standby mode, the power transistor is turned on to make a first voltage equal to a predetermined voltage and during a sleep mode, the control signal is coupled to a first voltage. The predetermined voltage is greater than the first voltage.

Power management circuit in memory device

A device includes a memory array. The memory array includes a first sub-bank, a first strap cell coupled to the first sub-bank, and a first continuous data line. The first continuous data line includes a first portion and a second portion coupled to the first sub-bank via the first strap cell. The first portion of the first continuous data line is disposed above the first strap cell and the second portion of the first continuous data line is disposed above the first portion of the first continuous data line.

A device includes a memory array. The memory array includes a first sub-bank, a second sub-bank, a strap cell and a continuous data line. The strap cell is arranged between the first sub-bank and the second sub-bank. The continuous data line includes a first portion coupled to the first sub-bank and a second portion disposed across the second sub-bank. The first portion of the continuous data line and the second portion of the continuous data line are disposed at separate layers above the strap cell.

A device includes a memory array including a first sub-bank, a second sub-bank, a first strap cell and a data line. The first strap cell is arranged between the first sub-bank and the second sub-bank. The data line includes a first portion and a second portion. The first portion is arranged across the first sub-bank. The second portion is arranged across the second sub-bank, and is coupled to the first portion via the first strap cell.

A device includes a first strap cell, a first data line, and a second data line. The first strap cell is arranged between a first row of memory cells and a second row of memory cells in a memory array. A first portion of the first data line is configured to transmit data to or from a first memory cell in the first row of memory cells. The second data line and a second portion of the first data line are configured to transmit data to or from a second memory cell in the second row of memory cells.

A device includes a memory array, a first data line, and a second data line. The memory array includes a first strap cell, a first sub-bank, and a second sub-bank, in which the first strap cell is disposed between the first sub-bank and the second sub-bank. The first data line has a first portion and a second portion, in which the first portion of the first data line is disconnected from the second portion of the first data line, and the second portion of the first data line is configured to couple the first sub-bank to a first input/output (I/O) circuit. The second data line and the first portion of the first data line are configured to couple the second sub-bank to the first I/O circuit.

Memory devices with strap cells

A bias voltage monitoring circuit is disclosed which comprises a first device coupled between a positive high voltage power supply (VDD) and a first node, a second device coupled between the first node and a second node where the bias voltage is applied, and a pad coupled to the first node, wherein the first and second devices form a voltage divider and a voltage measured at the pad reflects the bias voltage, and the first device and the second device is so chosen that a voltage at the first node is always positive for a given range of the bias voltage.

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Taichung, Taiwan

Chi-Ting Cheng