Intel Corporation

Chi-Te Chen

Wei-Lun Kane Jen

Li-Sheng Weng

Yun Ling

Olivia Chen

Chung-Hao Chen

Wei Qian

Srinivas Thota

Xing Jian Cai

Long Wang

Yihong Yang

Jue Chen

Su Mi Sam

Some embodiments include apparatuses and electrical models associated with the apparatus. One of the apparatuses includes an integrated circuit having a die; a package substrate; first conductive connections coupled between the die and a first side of the package substrate; second conductive connections located on a second side of the package substrate opposite from the first side. The second conductive connections are coupled to the first conductive connections through conductive paths in the package substrate. The first conductive connections and the conductive connections are associated with an S-parameter of an electrical model of the integrated circuit package. The electrical model further includes at least one of a current value associated with a power rail of the integrated circuit package, an impedance target associated with a location at the integrated circuit package, and a mapping associated with the first and second conductive connections.

Platform power integrity design including package standard power integrity model and compact voltage regulator module model

A microelectronic structure may be formed comprising a microelectronic package having a plurality of interconnects and a microelectronic substrate including an upper metallization layer and a solder resist structure, wherein the solder resist structure includes a first structure which forms an electrical connection between a first interconnect of the plurality of interconnects of the microelectronic package and the upper metallization layer of the microelectronic substrate, and wherein solder resist structure includes a second structure which prevents second interconnect of the plurality of interconnects of the microelectronic package from making electrical contact with the upper metallization layer.

Solder resist layer structures for terminating de-featured components and methods of making the same

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Folsom, CA, United States of America

Chi-Te Chen