National Chip Implementation Center National Applied Research Laboratories

National Applied Research Laboratories

National Chip Implementation Center

Chi-Shi Chen

Chien-Ming Wu

Chun-Ming Huang

Chi-sheng Lin

Shih-Lun Chen

Chin-Long Wey

Chih-Chyau Yang

The present invention provides a method for manufacturing a modularized integrated circuit (IC). The method includes the following steps: providing a base; and coupling an input/output module with the base. The base includes a lead-frame and a first package. The first package covers the lead-frame but exposes first contact points. The input/output module includes a first substrate, a plurality of first conducting columns, and a plurality of third contact points. A portion of each of the third contact points is electrically connected to a corresponding one of the first contact points. The method enhances the flexibility of IC design, and reduces the time and costs of developing new process techniques.

Method for manufacturing modularized integrated circuit

A three-dimensional SoC structure formed by stacking multiple chip modules is provided. The three-dimensional SoC structure includes at least two vertical SoC modules and at least one connector module, wherein each connector module electrically connects two vertical SoC modules. Each vertical SoC module is constructed by stacking at least two chip modules vertically. Each chip module includes a module circuit board and at least one preset element. A recess is formed in each module circuit board and provided with a first connecting interface for electrically connecting with the corresponding at least one preset element. The at least two vertical SoC modules are connected by the connector module to form a three-dimensional SoC structure with multiple functions. Besides, the recesses formed in the module circuit boards provide effective heat dissipation paths for the preset elements.

Three-dimensional SoC structure formed by stacking multiple chip modules

A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.

Multi-layer SoC module structure

Growing community of inventors

Hsinchu, Taiwan

Chi-Shi Chen