Mediatek Corporation

Chi-Sheng Yu

Jiann-Huang Liu

Shi-Wen Liu

Yen-Horng Chen

Chi-Kun Chiu

Meng-lin Chung

Hsin-Ying Lee

Tzung-Han Wu

Hua-Shan Chou

Chi-Tsan Chen

Lien Chien

Tang-Nian Luo

Peng-Ta Huang

The invention provides a radio frequency (RF) module and associated method with envelope tracking (ET) power supply in a device. The RF module may comprise a plurality of transmitters, an ET output, and an ET multiplexer. Each said transmitter may comprise an ET port and one or more RF outputs, and may be configured for providing an RF signal to one of said one or more RF outputs, and providing an ET signal, which reflects an envelope of the RF signal, to the ET port. The ET multiplexer may be coupled between said ET ports of the plurality of transmitters and the ET output, for selectively relaying one of said ET ports to the ET output.

Radio frequency module and associated method with envelope tracking power supply

An RF signal processing device includes multiple first signal receive paths receiving multiple first signals, multiple second signal receive paths receiving multiple second signals and a radio transceiver. The radio transceiver includes a first signal-processing circuit designed for processing the first signals, a second signal-processing circuit designed for processing the second signals, multiple first receive ports coupled to the first signal-processing circuit, multiple second receive ports coupled to the second signal-processing circuit, a first switch and a tunnel device. The first switch is coupled between at least one first receive port and the first signal-processing circuit. The tunnel device is coupled between the first switch and the second signal-processing circuit. The at least one first receive port coupled to the first switch is utilized to receive the first signal or the second signal.

Radio transceiver and RF signal processing device

An electronic device includes a circuit board. The circuit board includes a power amplifier footprint configured for mounting a first power amplifier or a second power amplifier thereon. The power amplifier footprint includes a first part and a second part. The first part includes multiple I/O pads. When the first power amplifier is mounted on the circuit board, the I/O pads in the first part are coupled to the first power amplifier. The second part includes multiple I/O pads. When the second power amplifier is mounted on the circuit board, both the I/O pads in the first part and the I/O pads in the second part are coupled to the second power amplifier.

Electronic devices for RF front end signal processing

Growing community of inventors

Taipei, Taiwan

Chi-Sheng Yu