United Microelectronics Corp.

Chi Ren

Liang Yi

Zhiguo Li

Xiaojuan Gao

Cheng-Yuan Hsu

Aaron Chen

Boon Keat Toh

Qiuji Zhao

Ju-Bao Zhang

Zhaobing Li

Zhao-Bing Li

Chun-Sung Huang

Wei Cheng

Ching-Long Tsai

Tzeng-Fei Wen

Yi Liu

Zhen Chen

Ling Wu

Wei Meng

Zhi-Hui Jiao

Zhi-Guo Li

Ping Liu

Chao-Sheng Hsieh

Qiu-Ji Zhao

A semiconductor memory device includes a substrate, an active region defined in the substrate by a trench isolation structure, a pair of floating gates on the substrate and at two sides of a fish-bone shaped recessed region of the active region, a source line doped region in the fish-bone shaped recessed region of the active region, wherein a bottom surface of the source line doped region extends above a bottom surface of the trench isolation structure, an erase gate disposed between the floating gates and on the source line doped region, a word line disposed on the substrate and adjacent to a side of each of the floating gates opposite to the erase gate, and a bit line doped region in the substrate and adjacent to the word line.

Semiconductor memory device and fabrication method thereof

An electrically erasable programmable read only memory (EEPROM) cell includes a first gate, a second gate and an erasing gate. The first gate and the second gate are disposed on a substrate, wherein the first gate includes a first floating gate and a first control gate stacked from bottom to top, and the second gate includes a second floating gate and a second control gate stacked from bottom to top. The erasing gate is sandwiched by the first gate and the second gate, wherein a side part of the first floating gate and a side part of the second floating gate right below the erasing gate both have multiple tips. The present invention also provides a method of forming the electrically erasable programmable read only memory (EEPROM) cell.

Electrically erasable programmable read only memory cell and forming method thereof

A memory device includes a semiconductor substrate, isolation structures, an erase gate, and floating gates. The isolation structures are disposed in the semiconductor substrate. Active regions separated from one another are defined in the semiconductor substrate by the isolation structures, and each of the active regions is elongated in a first direction. The erase gate is disposed on the semiconductor substrate and elongated in a second direction. The erase gate is disposed on the active regions and the isolation structures, and the erase gate is partly disposed in a recess within each of the isolation structures. The floating gates are disposed on the semiconductor substrate. The floating gates are arranged in the second direction and separated from one another, and each of the floating gates is partly disposed under the erase gate in a vertical direction.

Memory device

An integrated circuit structure includes an aluminum pad layer on a dielectric stack, a passivation layer covering the aluminum pad layer, and an aluminum shield layer including aluminum routing patterns disposed directly above an embedded memory area and embedded in the dielectric stack. The aluminum shield layer is electrically connected to the uppermost copper layer through a plurality of tungsten vias. The plurality of tungsten vias is embedded in the dielectric stack.

Integrated circuit structure

A control gate is formed on the substrate. A source diffusion region is formed in the substrate and on a first side of the control gate. A select gate is formed on the source diffusion region. The select gate has a recessed top surface. A charge storage structure is formed under the control gate. A first spacer is formed between the select gate and the control gate and between the charge storage structure and the select gate. A wordline gate is formed on a second side of the control gate opposite to the select gate. A second spacer is formed between the wordline gate and the control gate. A drain diffusion region is formed in the substrate and adjacent to the wordline gate.

A structure of memory device includes an active region in a substrate, a dielectric layer on the active region, and a floating gate disposed on the dielectric layer. The active region extends along a first direction in a top-view. The floating gate includes a first protruding structure extending along the first direction from a sidewall of the floating gate protruding from a top surface of the substrate. The whole of the first protruding structure is located in the active region.

Structure of memory device having floating gate with protruding structure

A method for forming a semiconductor memory device is disclosed. A substrate is provided. A source diffusion region is formed in the substrate. Two floating gates are on opposite sides of the source diffusion region. A first dielectric cap layer is formed directly on each of the floating gates. An erase gate is formed on the source diffusion region. The erase gate partially overlaps an upper inner corner of each of the floating gates. A second dielectric cap layer is formed on the erase gate and the first dielectric cap layer. A select gate is formed on a sidewall of the first dielectric cap layer in a self-aligned manner. A drain diffusion region is formed in the substrate and adjacent to the select gate.

Method for forming semiconductor memory device having a t-shaped erase gate

A semiconductor memory device includes a substrate, a pair of floating gates disposed on the substrate, a source line doped region in the substrate between the floating gates, an erase gate disposed between the floating gates and on the source line doped region, a word line disposed on the substrate and adjacent to a side of each of the floating gates opposite to the erase gate, and a bit line doped region in the substrate and adjacent to the word line. An upper surface of the source line doped region has a concave profile lower than a surface of the substrate and with a radius between 40 nm and 60 nm in a cross-sectional view perpendicular to the floating gates.

A semiconductor memory device includes a substrate; a control gate disposed on the substrate; a source diffusion region disposed in the substrate and on a first side of the control gate; a select gate disposed on the source diffusion region, wherein the select gate has a recessed top surface; a charge storage structure disposed under the control gate; a first spacer disposed between the select gate and the control gate and between the charge storage structure and the select gate; a wordline gate disposed on a second side of the control gate opposite to the select gate; a second spacer between the wordline gate and the control gate; and a drain diffusion region disposed in the substrate and adjacent to the wordline gate.

A semiconductor memory device includes a semiconductor substrate, a select gate on the semiconductor substrate, a control gate disposed adjacent to the select gate and having a first sidewall and a second sidewall, and a charge storage layer between the control gate and the semiconductor substrate. The control gate includes a third sidewall close to the second sidewall of the select gate, a fourth sidewall opposite to the third sidewall, and a non-planar top surface between the third sidewall and the fourth sidewall. The non-planar top surface includes a first surface region that descends from the third sidewall to the fourth sidewall. The charge storage layer extends to the second sidewall of the select gate.

Split gate memory with control gate having nonplanar top surface

An integrated circuit structure includes a substrate with a circuit region thereon and a copper interconnect structure disposed on the substrate. The copper interconnect structure includes an uppermost copper layer covered by a dielectric layer. An aluminum pad layer is provided on the dielectric layer. A metal layer is provided on the circuit region and is located between the uppermost copper layer and the aluminum pad layer.

Integrated circuit structure and fabrication method thereof

A silicon-oxide-nitride-oxide-silicon (SONOS) memory cell for FinFET includes a fin, a control gate and a selective metal gate. The fin is on a top surface of a substrate, wherein the fin has two sidewalls and a top surface, and the fin includes a memory region and a logic region. The control gate is disposed over the fin of the memory region and covers the two sidewalls and the top surface of the fin, wherein the control gate includes a charge trapping layer and a control electrode, wherein the charge trapping layer is sandwiched by the fin and the control electrode. The selective metal gate is disposed over the fin adjacent to the control gate and covers the two sidewalls and the top surface of the fin. The present invention also provides a method of forming said silicon-oxide-nitride-oxide-silicon (SONOS) memory cell.

Silicon-oxide-nitride-oxide-silicon (SONOS) memory cell for FINFET and forming method thereof

Method of forming silicon-oxide-nitride-oxide-silicon (SONOS) memory cell for FinFET

A structure of memory device includes trench isolation lines in a substrate, extending along a first direction. An active region in the substrate is between adjacent two of the trench isolation lines. A dielectric layer is disposed on the active region of the substrate. A floating gate corresponding to a memory cell is disposed on the dielectric layer between adjacent two of the trench isolation lines. The floating gate has a first protruding structure at a sidewall extending along the first direction. A first insulating layer crosses over the floating gate and the trench isolation lines. A control gate line is disposed on the first insulating layer over the floating gate, extending along a second direction intersecting with the first direction. The control gate line has a second protruding structure correspondingly stacked over the first protruding structure of the floating gate, and crosses over the trench isolation lines.

A semiconductor memory device includes a substrate; a source diffusion region in the substrate; a pair of floating gates disposed on opposite of the source diffusion region; a first dielectric cap layer disposed directly on each of the floating gates; an erase gate disposed on the source diffusion region and partially overlapping an upper inner corner of each of the floating gates; a second dielectric cap layer disposed on the erase gate and the first dielectric cap layer; a select gate disposed on a sidewall of the first dielectric cap layer; and a drain diffusion region disposed in the substrate and adjacent to the select gate.

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Singapore, Singapore

Chi Ren