Siliconware Precision Industries Co., Ltd.

Chi-Pin Tsai

Chih-Hsien Chiu

Ming-Fan Tsai

Chien-Cheng Lin

Tsung-Hsien Tsai

Heng-Cheng Chu

Chih-Yuan Shih

Yueh-Chiung Chang

Tsung-Li Lin

Chia-Yang Chen

Chi-Liang Shih

An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

Method for fabricating electronic package structure

Electronic package structure and fabrication method thereof

Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.

Electronic package with antenna structure

Growing community of inventors

Taichung, Taiwan

Chi-Pin Tsai