Cmos Sensor, Inc.

Chi-Pin Lin

Weng-Lyang Wang

Shengmin Lin

Feng Ke Hsiao

Feng-Ke Hsiao

A wafer-scale linear image sensor chip (WLISC) is proposed with gapless pixel line and signal readout circuit segments. The WLISC converts pixel line image (PLI) of length Linto line image signal (LIS). The WLISC includes a linear array of sensor segments. Each sensor segment includes a gapless local pixel line segment (LPLS) of sensing elements. The LPLSconverts portion of the PLI into a raw image segment signal set (RISS). The LPLSset forms a gapless global pixel line (GPL) corresponding to PLI. The sensor segment also includes readout circuit segment (RCS) coupled to LPLSfor processing RISSinto a readout image segment signal set (ROSS). The RCShas a set of contact pads (CTP) for off-chip interconnection. Upon off-chip interconnection of the CTPset thus composing the ROSSset into LIS, the WLISC functions as a key part of a linear image sensor system of image length L.

Wafer-scale linear image sensor chip and method with replicated gapless pixel line and signal readout circuit segments

A long-length industry camera image sensor (LICIS) is proposed for, expressed in X-Y-Z coordinates, converting a pixel line image (PLI) of length Lalong X-direction into a line image signal (LIS). The LICIS includes a full-width linear image sensor (FLIS) of length Lalong X-direction and displaced from the PLI along Z-direction by an imaging distance Dfor converting an incident line image (ILI) impinging upon its FLIS top surface into the LIS. Where Lis about equal to L. The LICIS also has a full-width linear rod lens (FLRL) of length Lalong X-direction and displaced from the PLI in Z-direction by a working distance D. Where Lis about equal to Land Dis selected such that the PLI gets focused by the FLRL into the ILI at the FLIS top surface with an imaging magnification factor of about 1:1.

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Kaohsiung, Taiwan

Chi-Pin Lin