Industrial Technology Research Institute

Taiwan Semiconductor Manufacturing Comp. Ltd.

Chi-Ming Huang

Chun-Jung Chen

Jian-Chiun Liou

Chia-Tai Chen

Shang-Yun Hou

Chien-Hung Liu

Sao-Ling Chiu

Ping-Kang Huang

Je-Ping Hu

Jinn-Cherng Yang

Hung-Liang Chiang

Kai-Chiang Wu

Han-Ping Pu

Hsin-Yu Pan

Shou-Zen Chang

Sen-Kuei Hsu

Albert Wan

Po-Fu Chou

Fa-Yuan Hsu

Chia-Cheng Chiao

En-Wei Chang

Tsung-Ding Wang

Chun-Fu Lu

Shyh-Haur Su

Shih-Kuo Wu

Kuo-Hsiang Chien

Yu-Hung Chuang

Shuang-Neng Peng

Jian-Chiun Lion

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.

Manufacturing method of semiconductor package

Semiconductor package and manufacturing method thereof

A semiconductor device structure is provided. The semiconductor device structure includes a first device. The semiconductor device structure includes a conductive element over the first device. The semiconductor device structure includes a first conductive shielding layer between the first device and the conductive element. The first conductive shielding layer has openings, and a maximum width of the opening is less than a wavelength of an energy generated by the first device. The semiconductor device structure includes a second conductive shielding layer under the first device. The first device is between the first conductive shielding layer and the second conductive shielding layer, and the second conductive shielding layer has a plurality of second openings.

Semiconductor device structure

A semiconductor device structure is provided. The semiconductor device structure includes a first device. The semiconductor device structure includes a conductive element over the first device. The semiconductor device structure includes a first conductive shielding layer between the first device and the conductive element. The first conductive shielding layer has openings, and a maximum width of the opening is less than a wavelength of an energy generated by the first device.

Semiconductor device structure and method for forming the same

An embodiment is a method for semiconductor packaging. The method comprises attaching a chip to a carrier substrate through a first side of a jig, the chip being attached by bumps; applying balls to bond pads on the carrier substrate through a second side of the jig; and simultaneously reflowing the bumps and the balls. According to a further embodiment, a packaging jig comprises a cover, a base, and a connector. The cover has a first window through the cover. The base has a second window through the base. The first window exposes a first surface of a volume intermediate the cover and the base, and the second window exposes a second surface of the volume. The first surface is opposite the volume from the second surface. The connector aligns and couples the cover to the base.

Packaging jig and process for semiconductor packaging

A nozzle plate suited for a droplet generator is provided. The nozzle plate includes a nozzle layer and at least one filler. The nozzle layer has a nozzle and at least one trench. The nozzle passes through the nozzle layer. The trenches apart from the nozzle are formed on a surface of the nozzle layer around the nozzle. The filler is filled in the trench. The wetting angle of the surface of the filler is different from the wetting angle of the surface of the nozzle layer. The nozzle plate has higher surface wear resistance and lower probability of jamming at the nozzle.

Nozzle plate

An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.

Inkjet printhead and manufacturing method thereof

A loop type heat dissipating apparatus with a sprayer for transferring heat between a heat source and a heat sink includes an evaporator, a condenser, and a working fluid. The evaporator contacts the heat source and includes a first chamber, a second chamber, and a sprayer disposed between therebetween. The condenser contacts the heat sink and includes a third chamber communicating with the second chamber and a wick structure disposed on one side of the third chamber. The working fluid fills the loop type heat dissipating apparatus and is turned into microdroplets via a sprayer. The sprayer impinges the microdroplets into the second chamber where the microdroplets are then evaporated by the heat source before proceeding to the third chamber for condensation, liquefaction and adhering to the wick structure. Eventually, the working fluid flows back to the first chamber under a pumping force actuated by the sprayer and completes the cycle.

Loop type heat dissipating apparatus with sprayer

A micro-spray system resonance frequency modulation method and device designed to minimize resonance frequency drift during atomization involves using a resonance frequency modulation unit for modulating resonance frequency and nodes, controlling and calibrating resonance frequency, and performing real-time measurement and correction to prevent operating frequency from drifting beyond a preferred operating frequency range, with a view to increasing spray flow and spray area, minimizing effects of ambient factors, and overcoming drawbacks of prior art.

Micro-spray system resonance frequency modulation method and device

A structure of inkjet-head chip and a method for making the same are disclosed. Driven by the need of making a thin insulator layer to lower the working power of the inkjet-head chip, we separately manufacture a passivation layer and a second conductive layer. The passivation layer and the second conductive layer have to be formed from different materials. The defining means for the passivation layer and the second conductive layer have high selectivity and do not overetch or damage the structure of inkjet-head chip.

Structure of inkjet-head chip

Method for making an inkjet-head chip structure

A component for the inkjet print head and the manufacturing method thereof are disclosed where photosensitive polymer is used as the substrate. Orifices and ink chambers are made on the substrate by photolithography. Conductive traces for interconnection to a print head chip are integrated to the substrate by combining photolithography and electroforming procedures.

Component for inkjet print head and manufacturing method thereof

Growing community of inventors

Changhua County, Taiwan

Chi-Ming Huang