Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Foxcomm Technology Co., Ltd.

Chi Liang

Chun-Chi Chen

Shi-Wen Zhou

Meng Fu

Hsieh-Kun Lee

A heat dissipating device includes a heat sink (), a radiator () and heat-transfer pipes (). The heat sink includes a chassis (), a plate () separate from the chassis and a plurality of fins () extending between the chassis and the plate. The radiator includes a base () parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion () thermally positioned to the chassis, a heat-releasing portion () thermally positioned to the plate and a heat-transfer portion () disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.

Heat dissipating device

A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins, and a plurality of ribs beneath the lath. The ribs are interposed between the fins.

A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.

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Chi Liang