Getac Technology Corporation

Chi-Jung Wu

Chun-Chi Wang

Chun-Yu Kuo

Min-Yu Wang

Provided is a protection method for use in fan malfunctions, applicable to an electronic device, and effective in preventing the electronic device from being overheated. The electronic device includes a fan, temperature sensor, and processor. The method includes steps of: limiting the processor's performance, upon determination that not only is the fan's rotation speed greater than or equal to a predetermined upper rotation speed limit, but the electronic device's temperature sensed by the temperature sensor is also greater than or equal to a predetermined upper temperature limit; determining whether the fan's rotation speed is less than or equal to a first restored rotation speed when the fan's rotation speed is determined to be less than the predetermined upper rotation speed limit; and stopping the limiting of the processor's performance when the fan's rotation speed is determined to be less than or equal to the first restored rotation speed.

Protection method and system for use in fan malfunction

A pluggable electronic device includes a base, a heat source module and an upper cover. The base is made of a metal material. The heat source is disposed at the base. The upper cover covers the heat source module, is connected to the base, and includes an enclosed cavity and an operating fluid cyclically performing evaporation and condensation in the enclosed cavity.

Heat dissipating housing and pluggable electronic device having the same

The invention discloses a heat dissipation architecture. The heat dissipation architecture includes an electronic component, a flexible heat conductive film and a heat conductor. The flexible heat conductive film is disposed on the electronic component. The heat conductor includes a first portion and a second portion connected to the first portion. The first portion of the heat conductor is interposed in the flexible heat conductive film.

Heat dissipation architecture

A shielding structure of a circuit board and an electronic device having the structure are disclosed. The electronic device includes a casing, a circuit board and a shielding structure. The shielding structure includes a shielding film and a ground guide member electrically configured on the circuit board. The shielding film includes two insulation layers and a metal layer placed between the two insulation layers, hence forming a sandwich structure. One of the insulation layers is adhered to the circuit board and is provided with an opening. The metal layer is exposed via the opening to form a guide portion, such that the shielding film can be electrically connected to the ground guide member through the exposed guide portion to further be grounded. Thus, complete noise shielding effects and efficient noise grounding effects are achieved.

Shielding structure of circuit board and electronic device having the same

A method and a computer system for reducing noise are provided. The method includes: setting the computer system's operating mode to normal mode or low-noise mode by a processing unit according to a selection signal; measuring an operating temperature of the processing unit; controlling a rotational speed of a fan unit conducive to dissipation of heat from the processing unit according to the operating temperature by a fan-control unit in normal mode; detecting the operating temperature according to a first threshold and starting an overheat-protection mechanism by the processing unit in normal mode when the operating temperature reaches the first threshold; shutting down the fan unit by the fan-control unit in low-noise mode; and detecting the operating temperature according to a second threshold lower than the first threshold and starting the overheat-protection mechanism by the processing unit in low-noise mode when the operating temperature reaches the second threshold.

Method and computer system for reducing noise from cooling fan

An edge sealing heat-dissipating film includes a heat radiation emitting film, a metal film and a heat radiation receiving film. The heat radiation emitting film has a first opening. The metal film is disposed to the heat radiation emitting film and the metal film has a second opening. The second opening is positioned corresponding to the first opening. The heat radiation receiving film is disposed to the metal film and the heat radiation receiving film has a third opening. Wherein, the shape of the heat radiation emitting film is the same as the shape of the heat radiation receiving film. And the area of the metal film is slightly smaller than the area of the heat radiation receiving film and the heat radiation emitting film. Therefore, the outer periphery of the heat radiation emitting film and the outer periphery of the heat radiation receiving film could be closely bonded together.

Edge sealing heat-dissipating film

A portable electronic device includes a body and a display device connected to the body. The display device includes a display panel, an optical module, and a heat dissipation module including a vapor chamber and a light-emitting module. The vapor chamber has flow channels extending from a bottom side to a top side of the vapor chamber and working fluids capable of displacement therein. The light-emitting module is disposed at the bottom side. A rear frame element of the display device has a front bezel onto which the display panel is embedded and a rear receptacle. The front frame element is coveringly disposed at the rear frame element and presses against the display panel. First screwing elements screw the vapor chamber and the rear frame element together. Second screwing elements screw the vapor chamber, the front frame element, and the rear frame element together sequentially.

Heat dissipation module, display device having the same, portable electronic device having the same and assembling method for display device having the same

A testing method adapted for an electronic device operating an operating system at a particular temperature environment is provided. The method includes the steps of: determining whether an operating command is received; when the operating command is received, deriving a test, executing the test, and disabling a fan of the electronic device, wherein the test corresponds to one of a plurality of system states of an operating system, and includes a temperature threshold value corresponding to the system state and an entering action of the system state; and when the system state of the test corresponds to a work mode of the operating system, the test includes: continuously monitoring a temperature value of the central processing unit; and when the temperature value of the central processing unit reaches the temperature threshold value, enabling the fan and executing the entering action of the system state.

Testing method and electronic device

A speed-up booting module of an electronic device includes a first heat pipe with two ends connected to a first component and a second component respectively, and the first heat pipe including a first working fluid, wherein when a booting process is performed at a first environmental temperature, the heat from the first component in operation is transferred to the second component so that a temperature of the second component reaches an operating temperature; and a second heat pipe with two ends connected to the first component and a third component respectively, and the second heat pipe including a second working fluid, a boiling point of the second working fluid is higher than the boiling point of the first working fluid; wherein at a second environmental temperature, a temperature of the second component reaches the boiling point, the heat from the first component is transferred to the second component.

Electronic device and speed-up booting module and method thereof using heat pipes

A heat transferring module adapted to an electronic device is provided. The electronic device includes at least one heat source and a plurality of ready-to-heat elements. The heat transferring module includes at least one water head, at least two loop heat pipes, at least two pumps, and a working fluid. The water head is thermally connected to the heat source. The loop heat pipes are connected to the water head respectively, and at least one of the loop heat pipes is thermally connected to the ready-to-heat elements. Each pump is connected to the corresponding loop heat pipe. The working fluid flows into the water head and at least one of the loop heat pipes by at least one of the pumps, so heat generated by the heat source is transferred to at least one of the ready-to-heat elements. A method of starting up an electronic device is also provided.

Heat transferring module and start up method of electronic device

A heat dissipation module suitable for a host apparatus is provided. The heat dissipation module has a shell body. The shell body has a heat conductive side and an air outlet-inlet side. The air outlet-inlet side has an air outlet and an air inlet. A contact sink having a fixing portion and a contact portion is installed on the heat conductive side such that the contact portion contacts a position requiring heat dissipation in the host apparatus. A heat conductive tube is disposed in the shell body between the fixing portion of the contact sink and the air outlet. A heat dissipation fin is disposed on the air outlet. A waterproof fan is installed on the air outlet. The shell body and the contact sink define an enclosure having waterproof edges except for openings on the air outlet-inlet side.

Growing community of inventors

Taipei, Taiwan

Chi-Jung Wu