Taiwan Semiconductor Manufacturing Comp. Ltd.

Chi-Jen Hsieh

Chia-Hung Chu

Chih-Hsien Hsu

Hong-Hsing Chou

Hu-Wei Lin

Hsun-Peng Lin

Hua-Kuang Teng

Yuan-Ting Huang

Han-Chih Chung

Tsung-Cheng Huang

Yen-Chen Lin

Hsin-Kuo Chang

Jr-Wei Ye

Yueh-Chih Wang

Ching-Hsing Chiang

Carolina Poe

The present disclosure provides a method of cleaning a semiconductor wafer during a process of fabricating a semiconductor device. The method includes loading a semiconductor wafer into a wafer handling system. The method includes removing contaminant particles from an edge region of the wafer from the back side, wherein alignment marks are located in the edge region. The method includes collecting the removed contaminant particles and discarding the collected contaminant particles out of the wafer handling system. The disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer cleaning device that is operable to clean a predetermined region of the wafer on the back surface thereof. The predetermined region of the wafer at least partially overlaps with one or more alignment marks.

Removal of particles on back side of wafer

A method includes rotating a wafer at a first speed for a first time duration. The wafer is rotated at a second speed that is lower than the first speed for a second time duration after the first time duration. The wafer is rotated at a third speed that is higher than the second speed for a third time duration after the second time duration. A photoresist is dispensed on the wafer during the first time duration and at least a portion of a time interval that includes the second time duration and the third time duration.

Photoresist coating scheme

Growing community of inventors

Toufen, Taiwan

Chi-Jen Hsieh