Gm Global Technolgoy Operations, Inc.

Chi Hung Leung

Thaddeus Schroeder

Bruno P Lequesne

Andrzej M Pawlak

Robert W Ward

Shih-Chia Chang

Han-Sheng Lee

Dexter Dean Snyder

David B Hicks

Mordechay Schlesinger

Samuel Lorincz

Robert F Paluch

Qian Shi

Mark Ricketts

Iulian Nedelescu

Structures and fabrication methods of micromachined all-metal relays on silicon chips are described. The relay comprises a copper blade, electroformed into the lithographically patterned areas, with suitable dimensions of 1 mm.times.2 mm.times.0.01 mm (width.times.length.times.thickness) and a plurality of longitudinal slots to facilitate fabrication of the blade. The relay is actuated by electrostatic force, and no conduction current is required to hold the relay at either 'on' or 'off' state. Preferably, the relay is used in combination with a suitable arc suppression circuit.

Integrated electrostatically-actuated micromachined all-metal

Nesting electrical connectors comprising a substrate and a silver-nickel-carbon electrodeposit atop the substrate. The electrodeposit is at least about 0.5 micrometers thick, and comprises about 10 to about 25 atomic percent nickel which is dispersed as a discontinuous phase throughout a continuous phase of the silver and has a Scherrer grain size less than about 5 nanometers. The carbon comprises about 5 to about 15 atomic percent of the deposit and has a non-crystalline graphite structure.

Electroplated Ag-Ni-C electrical contacts

A magnetically latching solenoid apparatus is characterized by a non-magnetic armature carrying a permanent magnet having poles aligned with the throw axis of the device. The poles of the magnet are substantially aligned with corresponding pole pieces and define respective variable air gaps therebetween. The apparatus assumes one of two bistable magnetically latched states according to the one of the air gaps across which the magnetic attractive force exceeds the magnetic attractive force across the other of the air gaps. Single or dual winding coils temporally excitable unidirectionally or bidirectionally and, in the case of dual winding coils mutually exclusively or contemporaneously, to cause the latch state to change.

Magnetically latching solenoid apparatus

A low-energy, long-life, magnetic latching apparatus includes a permanent magnet, an electro-magnet and a bi-stable armature. The magnetization axes of the permanent magnet and the electromagnet are substantially parallel to maximize respective flux coupling. Back-iron is located immediately adjacent the permanent magnet opposite the electro-magnet such that the permanent magnet is intermediate the back-iron and electro-magnet. The armature is arranged to minimize any air-gap between the armature and permanent magnet occasioned by the pivotal movement thereof. The back-iron provides for an increased permanent magnet working point and parallel flux path for electro-magnetic flux.

Magnetic latching relay

A magnetic field sensor assembly comprising a flexible circuit board having a major surface with a predetermined area for receiving at least one semiconductor magnetic field sensor chip, the chip is affixed to the predetermined area of the flexible circuit board in relationship to a predetermined reference location, which reference location can be used in encapsulation and/or use of the magnetic field sensor chip. Several magnetic field sensor chips can be readily, closely disposed on the flexible circuit board in predetermined known locations. The circuit board can conform to any desired predetermined shape. The shape can be determined by a circuit's conformation on a supporting magnet body.

Ultrathin magnetoresistive sensor package

A semiconductor magnetoresistive sensor and a method for its assembly is specifically provided. The preferred assembly method of this invention is compatible with automated semiconductor chip placement and packaging technology, so as to alleviate the previous requirement that the semiconductor sensing element be separately packaged. The sensor leads are substantially embedded within a powdered metal permanent magnet body. An exposed terminal end of each lead is available for electrical and adhesive contact to a subsequently attached magnetoresistive semiconductor sensing element, using conventional semiconductor placement and packaging techniques. The powdered metal magnetic body is preferably formed by utilizing powder metal compaction techniques, wherein the powder metal is compacted around the interior electrical leads. The teachings of this invention may also be employed to form a variety of electrical sensors and devices, wherein the leads are substantially embedded within a metal core so as to produce a solid assembly. The embedded leads may have a variety of shapes, such as straight or coiled, may range in number from one to a plurality, and may have a variety of physical properties, such as magnetic or non-magnetic, depending on the desired application.

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Rochester Hills, MI, United States of America

Chi Hung Leung