Taiwan Semiconductor Manufacturing Comp. Ltd.

Winbond Electronics Corporation

Richwave Technology Corp.

Windbond Electronics Corp.

Chi-Hung Kao

Chuan-Jane Chao

Chih-Mu Huang

Jeng Gong

Shih-Hui Chen

Tsung-Yi Huang

Chih-Wei Chen

Shyh-Chyi Wong

Kuo-Shu Huang

Cheng-Min Lin

Yun-Shan Chang

Jung-Yu Tsai

Kuo-Hsu Huang

Meng-Chi Wu

Jia-Rong Yu

A linearized bias circuit with adaptation resolves the problem happening to the power amplifier with conventional bias circuit that the DC and AC characteristics of the power amplifier shift or even deteriorate due to a temperature variation. The linearized bias circuit with adaptation has a reference voltage source, a first voltage source, a first resistor, a second resistor, a first NPN transistor, a second NPN transistor, and a third NPN transistor. The present invention has the characteristics of bias current temperature compensation, gain and phase compensations to achieve high linearity for the conventional power amplifier and reducing the DC consumption power. At the same time, the quantity of the required elements and layout area in the present invention are small so that the design complexity can be reduced for improving yield, reducing IC layout area, and reducing cost.

Linearized bias circuit with adaptation

Within both a lateral double diffused metal oxide semiconductor (LDMOS) device, and a method for fabrication thereof, there is formed a buried layer of polarity equivalent with a well region within which is formed a drain region. The buried layer is formed laterally aligned with respect to the well region, and separated therefrom by a portion of an epitaxial layer. The lateral double diffused metal oxide semiconductor (LDMOS) device exhibits enhanced electrical performance.

Lateral double diffused metal oxide semiconductor (LDMOS) device with aligned buried layer isolation layer

The present invention discloses a simple and convenient method for fabricating a capacitor device with BiCMOS processes. An electrode of the capacitor device formed according to the present invention is an ion doping region formed in an epitaxy layer so that the thickness of the dielectric layer of the capacitor device decreased relative to a specific ion concentration. Accordingly, the capacitor device formed therein has a high capacitance and good performance.

Method for fabricating a capacitor device with BiCMOS process and the capacitor device formed thereby

A method of manufacturing a LDHOS transistor having a dielectric block under the gate electrode. A high voltage well, low voltage well (LV PW), and field oxide regions having bird beaks are provided in a substrate and overlay the high voltage well and the low voltage well. In a key step, a dielectric block is formed over the bird beaks of the field oxide regions. A gate is formed over the dielectric block. After this the LDMOS device is completed. The invention's dielectric block covers the bird's beaks of the field oxide regions and enhances the e-field tolerance. The invention's e-field enhancement dielectric block relieves the e-field near the bird's beak, thus increasing the breakdown voltage of the transistor.

Method of fabricating a LDMOS transistor

A method is used to fully extract coupling coefficients of a flash memory cell by a GIDL manner. The flash memory cell is composed of a substrate, a drain region, source region, a control gate and a floating gate. The method keeps the source voltage Vs and the substrate voltage Vb fixed. The drain voltage Vd and the control gate voltage are varied. Then, measuring a GIDL current obtains a first coefficient ratio of the drain coupling coefficient ad to the gate coupling &agr;cg, that is, &agr;d/&agr;cg. Similarly, keeping the drain voltage Vd and the substrate voltage Vb fixed and varying the source voltage Vs and the control gate voltage Vcg, a second coefficient ratio of the source coupling coefficient &agr;s to the gate coupling coefficient &agr;cg, that is, &agr;s/&agr;cg. Similarly, keeping the drain voltage Vd and the source voltage Vs fixed and varying the control gate voltage Vcg and the substrate voltage Vb, a third coefficient ratio of the substrate coupling coefficient &agr;b to the gate coupling coefficient &agr;cg, that is, &agr;b/&agr;cg. The first coefficient ratio &agr;d/&agr;cg, the second coefficient ratio &agr;s/&agr;cg, and the third coefficient ratio &agr;b/&agr;cg incorporate a normalization equation of &agr;d&plus;&agr;s&plus;&agr;b&plus;&agr;cg&equals;1, so that all four coefficients &agr;d, &agr;s, &agr;b, and &agr;cg can be exactly solved.

Method for extracting substrate coupling coefficient of a flash memory

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Taipei, Taiwan

Chi-Hung Kao