Asm Technology Singapore Pte Ltd

Chi Hang Kwok

Chi Wah Cheng

Lap Kei Chow

An apparatusfor singulating an object is disclosed. The apparatuscomprises a laserconfigured to emit a laser beamwith a Gaussian irradiance profile, as well as a beam-shaping deviceconfigured to reshape the Gaussian irradiance profile of the laser beamemitted from the laser. In particular, the beam-shaping devicehas a plurality of aspherical lensesto redistribute irradiance of the laser beam, so as to reduce variation of the irradiance in an effective irradiation spectrum of the laser beamfor singulating the object. By redistributing the irradiance of the laser beam, irradiation energy may be more efficiently delivered to the semiconductor waferfor laser singulation, compared with conventional laser beams with Gaussian irradiance profiles which are non-uniform. A method of singulating an object is also disclosed.

Laser apparatus for singulation, and a method of singulation

A laser processing method is disclosed, comprising the steps of: directing a laser beam to a workpiece; and effecting a relative motion between the laser beam and the workpiece. In particular, the step of directing the laser beam to the workpiece comprises focusing the laser beam within the workpiece until an internal damage forms within the workpiece and a crack propagates from the internal damage to at least one surface of the workpiece to form a surface crack on the workpiece. Further, the step of effecting the relative motion between the laser beam and the workpiece is such that the surface crack on the workpiece propagates along a line of separation on the workpiece. A laser processing apparatus is also disclosed.

Growing community of inventors

Hong Kong, China

Chi Hang Kwok