Samsung Electronics Co., Ltd.

Chi-Goo Kang

Ho-Young Song

Young-Ho Park

Jong-sup Song

Seog-Ho Lim

Jong-Won Park

Young-Kyung Kim

Sun-Woo Kim

A light emitting device package includes a mounting substrate including first and second lower electrode portions separated by a first groove, first and second upper electrode portions separated by a second groove connected to the first groove and disposed on the first and second lower electrode portions respectively, and an insulation support member filling the first groove, a light emitting device mounted on the first and second upper electrode portions of the mounting substrate, a double phosphor film covering an upper surface of the light emitting device, including a phosphor layer and a barrier layer sequentially stacked on each other, and having a thickness of 200 &#x3bc;m or less, and a sealing member on the mounting substrate covering the light emitting device and the double phosphor film.

Light emitting device package and method of manufacturing light emitting device package

A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device.

Packaged light emitting devices including electrode isolation structures and methods of forming packaged light emitting devices including the same

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Seoul, South Korea

Chi-Goo Kang