Industrial Technology Research Institute

California Institute of Technology

Industrial Technology Research Center

Chi-Fu Tseng

Chyi-Ming Leu

Tien-Shou Shieh

Chih-Cheng Lin

Jauder Jeng

Hsueh-Yi Liao

Hsien-Kuang Lin

Nai-Chang Yeh

Yueh-Chuan Huang

Yung-Lung Tseng

Chin-Hui Chou

Chen-Hsuan Lu

Ming-Hsueh Chiang

A double-sided optically clear adhesive is provided. The double-sided optically clear adhesive includes a first adhesive layer and a second adhesive layer. The first adhesive layer includes a first resin and a first thermal-crosslinking agent. The first resin includes a hydroxyl group. The first thermal-crosslinking agent includes a first group. The second adhesive layer includes a second resin and a second thermal-crosslinking agent. The second resin includes a hydroxyl group. The second thermal-crosslinking agent includes a second group. The ratio of the equivalent number of the first group of the first thermal-crosslinking agent to the equivalent number of the hydroxyl group of the first resin is represented by r. The ratio of the equivalent number of the second group of the second thermal-crosslinking agent to the equivalent number of the hydroxyl group of the second resin is represented by r, wherein r<r≤0.8 and r−r≥0.025.

Double-sided optically clear adhesive and multilayer structure including the same

A method of forming graphene on a flexible substrate includes providing a polymer substrate including a metal structure and providing a carbon source and a carrier gas. The method also includes subjecting the polymer substrate to a plasma enhanced chemical vapor deposition (PECVD) process and growing a graphene layer on the copper structure.

Methods and devices for graphene formation on flexible substrates by plasma-enhanced chemical vapor deposition

An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of wherein X is &#x2014;O&#x2014;, and each Ris independently CH, CHF, CHF, or CF. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.

Oligomer, composition, packaging structure, and method of disassembling packaging structure

A method for fabricating a flexible electrical device is provided. The method includes providing a first substrate, providing a second substrate opposed to the first substrate, wherein one of the first and second substrates includes a polyimide polymer of Formula (I) wherein B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A' is an aromatic or aliphatic group, and 1&#x2266;n/m&#x2266;4, directly fabricating a thin film transistor (TFT) on one of the first and second substrates which includes the polyimide polymer of Formula (I), and disposing a medium layer between the first substrate and the second substrate.

Method for fabricating flexible electrical devices

A polyimide polymer solution, a polyimide polymer, a transparent film, a display device and a solar cell are provided. The polyimide polymer has at least one of a repeating unit of formula (D) and a repeating unit of formula (J) and at least one of a repeating unit of formula (Q) and a repeating unit of formula (T).  One of B and B' is cyclo-aliphatic compound, and the other is aromatic compound, a molar mass ratio of the cyclo-aliphatic compound to the aromatic compound is 1&#x2dc;4, A and A&#x2032; are identical or different aromatic diamines, and at least one of A and A&#x2032; is aromatic diamine with ether groups, and A could be the same as or different from A&#x2032;.

Polyimide polymer solution, polyimide polymer, transparent film, displaying device and solar cell

A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a flexible substrate opposed to the carrier, a release layer formed on a surface of the flexible substrate opposed to the carrier, and an adhesive layer formed between the carrier, the release layer and the flexible substrate, wherein the area of the adhesive layer is larger than that of the release layer, and the adhesive layer has a greater adhesion force than that of the release layer to the flexible substrate. The invention also provides a method for fabricating the substrate structure.

Growing community of inventors

Taipei, Taiwan

Chi-Fu Tseng