Cyntec Company

Authentrend Technology Inc.

Chi-Feng Huang

Da-Jung Chen

Bau-Ru Lu

Jeng-Jen Li

Huei-Ren You

Yi-Tsung Chen

Jhih-You Lin

An electronic structure comprising: a circuit board, wherein electronic devices and a transformer are disposed on the circuit board, wherein the transformer comprises a first coil, a second coil, and a magnetic body comprising a pillar with at least one portion of the pillar being disposed in a through-opening of the circuit board, wherein the first coil is wound around an upper portion of the pillar and the second coil is wound around a lower portion of the pillar for forming the transformer.

Electronic structure having a transformer

An electronic structure comprises: a circuit board, wherein a plurality of electronic devices and a transformer are disposed on the circuit board, the transformer comprises a first coil, a second coil, and a magnetic body, wherein a molding body encapsulates at least one portion of the outer surface of the first coil, at least one portion of the outer surface of the second coil, and the plurality of electronic devices for electrically isolating the plurality of electronic devices from the transformer.

A multi-functional authentication apparatus and an operation method for the same are provided. The multi-functional authentication apparatus integrates multiple communication modules into one device. A biometric authentication procedure is firstly performed when activating this multi-functional authentication apparatus. A security code is generated through a security authentication mechanism provided by this apparatus after reading biometric features. After that, according to a connection protocol, one of the communication modules of the multi-functional authentication apparatus is activated to connect with an external host. The security code is transmitted to the host via the communication module for identifying a user. The multi-functional authentication apparatus acts as an authenticator that allows a user to login to a computer system or obtain a network service after authentication. The multi-functional authentication apparatus also provides authentication for the user to open an access control device or conduct a mobile payment.

Multi-functional authentication apparatus and operating method for the same

An electronic module is disclosed, wherein the electronic module comprises: a first circuit board, comprising a top surface, a bottom surface, and a lateral surface connecting the top surface and the bottom surface of the first circuit board; wherein an electrode structure is disposed on the first circuit board, wherein a second circuit board is disposed under the bottom surface of the first circuit board, wherein a soldering material is disposed between the bottom surface of the electrode structure and the second circuit board and extended onto a wettable flank of the electrode structure to form a soldering structure, wherein said soldering structure comprises an outer surface that is located above the bottom surface of the first circuit board and outside the outmost portion of the lateral surface of the first circuit board.

Circuit board and electronic module with an electrode structure

A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar without using any substrate.

Method to form a stacked electronic structure

A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar, without using any substrate.

Stacked electronic structure

A stacked electronic structure is provided. The stacked electronic structure includes: a magnetic device, electronic devices, and a substrate. The substrate is disposed under the magnetic device. First and second electronic devices are disposed between a bottom surface of the magnetic device and a top surface of the substrate. The first and second electronic devices comprise first and third terminals, disposed on first and second surfaces thereof, respectively, electrically connected to the magnetic device without using the substrate. The first and second electronic devices also comprise second and fourth terminals, disposed on second and fourth surfaces thereof, respectively, electrically connected to the substrate.

An electronic package structure is provided which comprises a metal core PCB, an energy storage device and at least one electronic component. The at least one electronic component is disposed between the metal core PCB and the energy storage device. The metal core PCB defines at least a through hole. A thermal passage is disposed in the through hole. An insulating layer is disposed in the through hole and located between the metal layer of the metal core PCB and the thermal passage to prevent the electric coupling between the thermal passage and the metal layer. The energy storage device comprises at least a connecting pin in thermal contact with the thermal passage.

Metal core printed circuit board and electronic package structure

An electronic element packaging module including a lead frame, an insulating layer and at least one electronic element is provided. The lead frame is a patterned metal sheet and has a first surface, a second surface opposite thereto and a through trench passing from the first surface to the second surface. A substrate portion and a plurality of lead portions around the substrate portion of the lead frame are defined by the through trench. The second surface of the lead frame is exposed outside the electronic element packaging module. The insulating layer disposed in the through trench has a third surface and a forth surface substantially coplanar with the first and the second surfaces, respectively. The electronic element disposed on the first surface is coupled to the lead frame.

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Taipei, Taiwan

Chi-Feng Huang