Industrial Technology Research Institute

Chi-En Kuan

Wei-Ta Yang

Chih-Ming Hu

Jeng-Yu Tsai

Jyh-Long Jeng

Chen-Hsi Cheng

Yen-Yi Chu

Hsi-Yi Chin

Yi-Syuan Wang

An anhydride compound, polyimide, and thin film are provided. The anhydride compound has a chemical structure of wherein Ris each of Ris independently Calkylene group, m is an integer of 0 to 10, and m' is an integer of 1 to 10; n is an integer of 1 to 10, each of Ris independently hydrogen, saturated or unsaturated Chydrocarbon group, CF, silanol group, silyl group, or Al(OH); and Ris silanol group, silyl group, or Al(OH). The anhydride compound can be reacted with a diamine compound to form a polyimide.

Anhydride compound, polyimide, and thin film

The disclosure provides a film composition, wherein the film composition includes an oligomer and a crosslinking agent. The oligomer can have a structure represented by Formula (I) wherein Rand Rare independently hydrogen, Calkyl group, Calkenyl group, Caryl group, Calkylaryl group, Ccycloalkyl group, Ccycloalkylalkyl group, alkoxycarbonyl group, or alkylcarbonyloxy group; Ris not hydrogen when Ris hydrogen; a is 0 or 1; 100&#x2265;n&#x2265;1; 100&#x2265;m&#x2265;1; and when n is not 0, the ratio of n to m is from 3:1 to 1:4. The weight ratio of the oligomer and the crosslinking agent can be from 9:1 to 3:7. The oligomer has a number average molecular weight (Mn) from 1,000 to 8,000.

Film composition and a film prepared thereby

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