Asm Assembly Automation Limited

Chi Chuen Chaw

Deming Liu

Wai Tien Chan

Ran Fu

Hing Leung Li

Yiu Fai Kwan

Hing Suen Siu

Jianxiong Li

Ngai Kin Tsui

A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.

Flip chip bonding tool

A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.

Coating for enhancing adhesion of molding compound to semiconductor devices

Growing community of inventors

Hong Kong, China

Chi Chuen Chaw