Siliconware Precision Industries Co., Ltd.

Chi Chuan Wu

Ho-Yi Tsai

Randy H Y Lo

Jui-Yu Chuang

Yude Chu

Chian Ping Huang

A semiconductor package and its fabricating method are proposed, in which a plurality of passive devices are integrated under a semiconductor chip, so as to increase the layout number of the passive devices in the semiconductor package and enhance the flexibility of substrate routability, as well as reduce an occupied area of a substrate for miniaturize the semiconductor package in profile. Moreover, as the integrated passive devices are further encapsulated by using an insulative material prior to a molding process, the dislocation of the passive devices caused by a high temperature and mold flow of a molding resin can be prevented from occurrence during molding. Furthermore, the encapsulated passive devices are prevented from contacting bonding wires, allowing the occurrence of short circuit to be avoided and quality of the packaged product to be assured.

Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof

A semiconductor package with a heat-dissipating structure and a method for making the same are proposed. The heat-dissipating structure includes a heat sink and a plurality of solder columns, wherein the solder columns are attached at ends thereof to the heat sink and to a substrate, so as to support the heat sink to be positioned above a semiconductor chip mounted on the substrate. A reflow process performed after the attachment of the heat-dissipating structure to the substrate allows the self-alignment of the solder columns with respect to predetermined positions on the substrate, which helps precisely control the positioning of the heat-dissipating structure fixed on the substrate. Moreover, the solder columns can protect the substrate from being damaged or deformed during a molding process. In addition, the heat-dissipating structure is simple in structure, which simplifies the manufacturing process and reduces the cost.

Semiconductor package with heat-dissipating structure and method of making the same

The present invention is characterized by replacing solder balls with cylindrical terminals in an IC package where at least a chip is located on the same side of the substrate of the IC package as the solder balls are. Due to the larger length of the cylindrical terminals which are located on the same side of the substrate of the IC package as at least a chip is, at least a chip with relatively thick size can be accommodated in the IC package provided by the present invention, without need of increasing terminal pitch (such as the ball pitch in a conventional BGA package). The accommodation of relatively thick chip in the IC package provided by the present invention leads to elimination or significant reduction of cost of back grinding of the chip, and to significant improvement on the failure rate resulting from the thinness of the chip in a conventional IC package, while without need of augmenting the size of the substrate of the IC package as a result that the terminal pitch based on the present invention needs not be increased.

Package structure for accommodating thicker semiconductor unit

With increasing density and improving performance as well as growing function variety of the circuits integrated in a semiconductor chip, the heat dissipating capability of an IC package must be effectively promoted. An IC package based on a simple structure while capable of achieving better heat dissipation is therefore suggested by the present invention. The present invention is applicable to the IC package in which at least a semiconductor unit is located on the same side of substrate as terminals (such as solder balls or cylindrical terminals) are. The basic structure of the IC package comprises an electronic apparatus and a heat dissipater. The electronic apparatus includes a carrier such as a substrate, at least a semiconductor unit such as a chip/die, and at least a cylindrical terminal. The semiconductor unit and the cylindrical terminal attaches in approximately the same direction to the carrier. The heat dissipater includes at least a through-hole for the cylindrical terminal to penetrate, thereby the heat dissipater may be close to the carrier, whereby the IC package provides better heat dissipation without need of larger or more complicated structure.

IC package structure for achieving better heat dissipation

The present invention suggests a new scheme of integrating a heat conducting promotion apparatus (or heat sink) and a chip carrier (such as a substrate) of an IC package including a chip. It is characterized by at least a cavity which is in the chip carrier and around the chip, and the configuration of the heat conducting promotion apparatus having a first part which is close to or contacts a heat conducting surface of the chip, and a second part which extends from the first part toward the cavity until it partly contacts a surface of the chip carrier and partly is inside of the cavity. It is also characterized by options of placing at least an elastic entity in the cavity to contact the heat conducting promotion apparatus' part which is inside the cavity, or twisting the heat conducting promotion apparatus' part which is inside the cavity. Such schemes immunize an IC package against the warpage of heat conducting promotion apparatus resulting from the thermal stress suffered by the chip in the IC package, thereby the adaptability of the IC package to environment and the quality reliability of the IC package can be significantly promoted.

Growing community of inventors

Taichung, Taiwan

Chi Chuan Wu