Pixart Imaging Incorporated

Pixart Imaging Incorporation

Chi-Chih Shen

Yi-Chang Chang

Yen-Hsin Chen

Kuo-Hsiung Li

Jui-Cheng Chuang

Hung-Ching Lai

Shang-Feng Hsieh

Jen-Yu Chen

Yen-Min Chang

Hui-Hsuan Chen

Cheng-Nan Tsai

Yen-Chang Chu

Cheng-Lin Yang

Chih-ming Sun

There is provided an optical machine of a smoke detector including a substrate, a light source, a light sensor and a light blocking member. The light source and the light sensor are arranged on the substrate in a first direction. The light blocking member is arranged upon the light source and blocks a part of an emission angle of the light source in the first direction far away from the light sensor.

Optical machine of smoke detector

An optical component packaging structure is provided. The optical component packaging structure includes a substrate, a far-infrared sensor chip, a metal covering cap and a light filter. The far-infrared sensor chip is disposed on the substrate and electrically connected to the substrate. The metal covering cap is disposed on the substrate and accommodating the far-infrared sensor chip. The metal covering cap has an opening exposing the far-infrared sensor chip. The light filter is disposed out of the opening and on the inner surface for covering the opening to filter the far-infrared light passing through. The far-infrared sensor chip is surrounded by the metal covering cap, the substrate and the light filter, and the metal covering cap is directly connected with the substrate.

Far-infrared sensor packaging structure

There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.

Miniaturized optical sensor package and manufacturing method thereof

The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

Optical component packaging structure

An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly includes a frame and a shielding element. The shielding element has a first light-permeable region disposed above at least a first subset of the pixels, the first subset is configured to receive corresponding light, and the first light-permeable region is transparent to the corresponding light. The shielding element includes an engaging structure formed thereon, and the shielding element is engaged with the frame by the engaging structure.

Optical sensor package module

A manufacturing method of a sensor chip package structure is provided. In the manufacturing method, a wafer including a plurality of sensor chips is provided, and each sensor chip has an active region and defines a pre-thinned region thereon. Each pre-thinned region is located at one side of the active region and covers a boundary line of each sensor chip. The pre-thinned region of each sensor chip is etched to form a concave portion. A redistribution layer is formed on the wafer. Subsequently, the wafer is cut to separate the sensor chips from one another, and each separated sensor chip has a wiring layer extending from the active region along a sidewall surface to a bottom surface of the concave portion. The separated sensor chips are respectively mounted on a plurality of substrates, and the active region is electrically connected to the substrate through the wiring layer.

Manufacturing method of sensor chip package structure

An optical sensor module and a sensor chip thereof are provided. The optical sensor module includes a substrate, a sensor chip and a passive chip. The sensor chip is disposed on the substrate, and the sensor chip includes a chip body having an active region located at a top side thereof and a recess portion depressed from a top surface of the chip body. The passive chip is accommodated in the recess portion, and a depth of the recess portion is greater than a thickness of the passive chip.

Optical sensor module and sensor chip thereof

An optical detecting device has gas emission and pressure reduction function and includes a holder, a light penetrating component, a light detecting component, a hole structure, and a. The light penetrating component is disposed on the holder to form an accommodating space whereinside the light detecting component is disposed. The hole structure is formed on the holder to connect with the accommodating space. The waterproofing and ventilating component is disposed on the holder and covers the hole structure to prevent liquid from leaking into the accommodating space via the hole structure. While an inner gas pressure of the accommodating space is decreased, part of the gas is exhausted from the accommodating space via the hole structure and the waterproofing and ventilating component.

Optical detecting device having gas emission and gas pressure reduction function

An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.

Optical sensor package module and manufacturing method thereof

An optical detecting device capable of preventing environmental pollution includes a casing, an optical detecting component and a transparent component. The casing includes a light through unit and at least one accommodating structure. The optical detecting component is disposed inside the accommodating structure. The transparent component is disposed inside the accommodating structure and located above the optical detecting component, to partly fill the accommodating structure at least and block between the light through unit and the optical detecting component.

Optical detecting device capable of preventing environmental pollution

The present disclosure discloses an optical module package structure and method thereof. The optical module includes a substrate, a shield, a photosensitive unit and a cover. The shield is disposed on the top of the substrate and forms a first housing space with the upper surface of the substrate. The photosensitive unit is disposed on the substrate and located in the first housing space. The shield has a light-receiving part above the photosensitive unit. At least one notch is on the outer surface of the shield. A cushion is disposed on the notch and protrudes on the upper surface of the shield. The cover is disposed on the cushion(s) and kept a constant distance to the upper surface of the shield by contacting with the cushion(s).

Growing community of inventors

Hsin-Chu, Taiwan

Chi-Chih Shen