Advanced Semiconductor Engineering, Inc.

Hewlett-packard Development Company, L.p.

Chi-Chih Huang

Shuo-Hsun Chang

Shu-Luan Chan

Sheng-Ming Wang

Chih-Cheng Chen

Lien-Chia Chiu

Yu Chen So

Weiming Tseng

Kuo-Hua Chang

Example of backlit switches are described. In an example, a backlit switch includes a printed circuit board (PCB) and a dome-type button coupled to the PCB. The dome-type button has a light transmitting portion. A light source is mounted on a first side of the PCB, and a tact switch is mounted on a second side of the PCB that is opposite to the first side. Further, a projection is provided to trigger the tact switch, in response to pressing of the dome-type button.

Backlit switches

A substrate structure is disclosed. The substrate structure includes a core substrate, an interconnection portion and a solder mask. The core substrate includes a top surface and a bottom surface opposite the top surface. A circuit pattern is disposed on the top surface. The interconnection portion is disposed on the top surface; herein the interconnection portion includes a surface dielectric layer and a surface circuit layer disposed on the surface dielectric layer. The surface circuit layer is electrically connected to the circuit pattern. The solder mask is disposed on the interconnection portion; herein the solder mask includes a hole to identify the substrate structure. Besides, a method for manufacturing the substrate structure is disclosed.

Substrate strip and substrate structure and method for manufacturing the same

A substrate structure is disclosed. The substrate structure includes a core substrate, an interconnection portion and a solder mask; herein the core substrate includes a top surface and a bottom surface opposite the top surface. A circuit pattern is disposed on the top surface. The interconnection portion is disposed on the top surface; herein the interconnection portion includes a surface dielectric layer and a surface circuit layer disposed thereon. The surface circuit layer is electrically connected to the circuit pattern, and the surface dielectric layer includes at least a hole that is not covered with the surface circuit layer. The solder mask is disposed on the interconnection portion; herein the solder mask includes an indentation disposed above the hole. In addition, a method for manufacturing the substrate structure is disclosed.

Substrate structure and method for manufacturing the same

A method for forming metal bumps is disclosed. Steps of the method include supplying a substrate containing a plurality of pads; forming a first photoresist layer on the substrate, herein the first photoresist layer covers the pads; performing a planarization step to remove a portion of the first photoresist layer so as to expose the pads; forming a conductive layer on the first photoresist layer and the pads; electroplating a metal layer on the conductive layer; forming a patterned second photoresist layer on the metal layer; a portion of the metal layer and the conductive layer which are not covered by the patterned second photoresist layer is removed by using the patterned second photoresist layer as a mask; removing the patterned second photoresist layer; and forming a solder mask on the substrate, wherein the solder mask has a plurality of openings to expose the metal layer located on the pads.

Growing community of inventors

Taipei, Taiwan

Chi-Chih Huang