Infineon Technologies Ag

Chew Theng Tai

Joachim Mahler

Swee Kah Lee

Soon Lock Goh

Jagen Krishnan

Yik Yee Tan

Poh Cheng Lim

Peh Hean Teh

Klaus Elian

Choo Tian Ooi

Mohd Hirzarul Hafiz Mohd Tahir

An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.

Embedding additive particles in encapsulant of electronic device

A molded sensor package includes a leadframe having a sensor die attached to the leadframe, a magnet aligned with the sensor die and a single molding compound encasing the sensor die and attaching the magnet to the leadframe. A method of manufacturing the molded sensor package includes loading the magnet and the leadframe into a molding tool so that the magnet is aligned with the sensor die in the molding tool, molding the magnet and the sensor die with the same molding compound while loaded in the molding tool and curing the molding compound so that the magnet is attached to the leadframe by the same molding compound that encases the sensor die.

Molded sensor package with an integrated magnet and method of manufacturing molded sensor packages with an integrated magnet

A primer composition is provided. The primer composition includes at least one bi- or multi-functional benzoxazine compound; and at least one compound including a functional group having affinity for a metallic surface, and a cross-linkable group. A method of forming a primer layer on a semiconductor device, and a method of encapsulating a semiconductor device are also provided.

Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device

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Melaka, Malaysia

Chew Theng Tai