Integrated Device Technology, Inc.

Cheun-Der Lien

Jeong Yeol Choi

Chung-Chyung Han

A method of improving latch-up immunity and interwell isolation in a semiconductor device is provided. In one embodiment, an implant mask which has a variable permeability to implanted impurities is formed on the surface of a substrate having a first dopant region. A first portion of the implant mask overlies a first portion of the first dopant region. The structure is subjected to high energy implantation which forms a heavily doped region. A first portion of the heavily doped region is located along the lower boundary of the first dopant region. A second portion of the heavily doped region which extends along a side boundary of the first dopant region is formed by impurity ions which pass through the first portion of the implant mask. The heavily doped region improves latch-up immunity and interwell isolation without degrading threshold voltage tolerance. In alternative embodiments, one variable permeability mask is used to form the first dopant region and also to form the heavily doped region continuous with the first dopant region.

Method for improving latch-up immunity and interwell isolation in a

A structure for improving latch-up immunity and interwell isolation in a semiconductor device is provided. In one embodiment, a substrate has an upper surface and a first dopant region formed therein. The first dopant region has a lower boundary located below an upper surface of the substrate and a side boundary extending from the upper surface of the substrate to the lower boundary of the first dopant region. A heavily doped region having a first portion and a second portion located along the lower boundary and the side boundary of the first dopant region, respectively, has a substantially uniform dopant concentration greater than a dopant concentration of the first dopant region. The heavily doped region improves latch-up immunity and interwell isolation without degrading threshold voltage tolerance.

Structure for improving latch-up immunity and interwell isolation in a

For electrostatic-discharge-protection, a first transistor is configured with the transistor channel connected between circuit ground and an associated (input or output) pad. In addition, transistors(s) are included configured to 'float' the gate and/or the well of the first transistor when no power supply potential (Vcc) is present and to couple to circuit ground (or the power supply potential) the gate and/or the well of the first transistor when the normal power supply potential (Vcc) is present.

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Los Altos Hills, CA, United States of America

Cheun-Der Lien