Techwing Co., Ltd.

Cheul-Gyu Boo

Tae-Hung Ku

Yun-Sung Na

Yun Sung Na

A pick-and-place module for test handlers is disclosed that includes a main body and a kit. The main body forms vacuum paths therein and the kit also forms vacuum passages therein. The kit is detachably mounted to the main body in a hook coupling manner. The pick-and-place module can be applied to all customer trays having different loading capabilities when only the kit of the pick-and-place module needs to be replaced, so there is no need to manufacture the entire pick-and-place module and this reduces manufacturing costs. The pick-and-place module can reduce the amount of resources to be replaced and reduce the replacement time since the kit can be easily removed from the main body of the pick-and-place module in a hook manner.

Pick-and-place module for test handler

A system to support the testing of electronic devices and a temperature control unit for the system are disclosed. A temperature controlling method for a chamber of the system is also disclosed. Low or high temperature air is supplied to the inside of the chamber when the electronic devices are tested at low or high temperature. External air is supplied to the inside of the chamber when the electronic devices are tested at room temperature.

System to support testing of electronic devices, temperature control unit for the system, and method for controlling internal temperature of chamber of the system

Growing community of inventors

Hwaseong Si, South Korea

Cheul-Gyu Boo