Endicott Interconnect Technologies, Inc.

International Business Machines Corporation

Cheryl L Palomaki

Voya Rista Markovich

Robert Maynard Japp

Kostas I Papathomas

David L Thomas

John M Lauffer

John Steven Kresge

William E Wilson

A method of making a circuitized substrate in which pairs of vertically oriented though holes are formed such that at least one of the through holes is partially embedded within a lower one, thus assuring a sound connection following subsequent lamination or other steps the substrate including such holes is subjected to during manufacture. An electrical assembly including a substrate with such features is also provided.

Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate

An information handling system which includes as part thereof a circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer.

Information handling system including a circuitized substrate having a dielectric layer without continuous fibers

A method of making a circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer.

Method of making circuitized substrate

A circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer. An electrical assembly and a method of making the substrate is also provided, as is a circuitized structure including the circuitized substrate in combination with other circuitized substrates having lesser dense thru-hole patterns. An information handling system incorporating the circuitized substrate of the invention as part thereof is also provided.

Circuitized substrate

Methods of filling apertures, for example, through holes, in substrates are provided. The methods utilize a dielectric film, preferably a photoimageable dielectric film, which is employed to fill the apertures and to form a dielectric film disposed above the substrate at the same time. As a result, the aperture fill material is the same as, and indeed continuous with, the dielectric film which is disposed on the substrate. The method employs the following steps: providing a substrate having apertures; providing a dielectric film disposed on the substrate covering the apertures, reflowing the dielectric film to flow into the apertures and to form a dielectric film adherent to the substrate, to provide a continuous dielectric extending from the dielectric film into the apertures. In certain embodiments, after filling, additional apertures, such as vias, are photoimaged in the dielectric film. Preferably the vias are then metallized, and circuitry formed atop the dielectric film.

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Endicott, NY, United States of America

Cheryl L Palomaki