3m Innovative Properties Company

Minnesota Mining and Manufacturing Company

Riker Laboratories Inc.

Cheryl L Moore

David B Olson

Ying-Yuh Lu

Michael D Determan

Albert I Everaerts

Jayshree Seth

Bettie C Fong

Greggory S Bennett

Donald H Lucast

Mary L Brown

Richard E Bennett

Louis E Winslow

Michael A Kropp

James L Bries

Todd R Williams

Donald R Battles

Stephen E Krampe

Richard J Goetz

Charles W Taylor

Karunasena A Alahapperuma

Ruth A James

Eric G Larson

Dong-Wei Zhu

Daniel C Duan

John D Moon

David J Plaut

James T Wolter

Michael K Martin

James E Garbe

Jamieson C Keister

Chan U Ko

Steven M Wick

Kimberly C M Schultz

Gregory R Nelson

William J Traynor

Albert I Evaraerts

Horst-Georg Zerbe

The present invention provides pressure-sensitive adhesives having a refractive index of at least 1.50. The pressure-sensitive adhesives comprise at least one monomer containing a substituted or an unsubstituted biphenyl group.

High refractive index pressure-sensitive adhesives

The present invention provides pressure-sensitive adhesives having a refractive index of at least 1.50. The pressure-sensitive adhesives comprise at least one monomer containing a substituted or an unsubstituted carbazole group.

High refractive index adhesives

A method for the manufacture of an adhesive id described, comprising: (A) Providing an initial reaction product of a solution polymerization reaction, the initial reaction product comprising polymer, unreacted polymerizable reactant, non-polymerizable material, and solvent; and (B) Purifying the initial reaction product by adding an oxidizing agent and a reducing agent to the initial reaction product and allowing the unreacted polymerizable reactant in the initial reaction product to further react, thereby providing a second reaction product comprising additional polymer and a lower level of unreacted polymerizable reactant than was present in the initial reaction product. Optionally, the method of the invention may further comprise: Precipitating the polymer from the second reaction product to provide a precipitated polymer, and separating the precipitated polymer from the remainder of the second reaction product, the precipitated polymer comprising a lower level of non-polymerizable material or unreacted polymerizable reactant or both non-polymerizable material and unreacted polymerizable reactant than was present in the second reaction product.

Method for the manufacture of pressure sensitive adhesives

Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.

Dicing and die attach adhesive

The present invention provides pressure-sensitive adhesives having a refractive index of at least 1.48. The pressure-sensitive adhesives comprise at least one monomer containing a substituted or an unsubstituted aromatic moiety.

A transdermal drug delivery device involving a macromonomer-containing acrylate or methacrylate copolymer, a softener, and a drug. Also a pressure sensitive skin adhesive involving a macromonomer containing acrylate or methacrylate copolymer and a softener.

Matrix for transdermal drug delivery

A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Semiconductor wafer processing tapes

A pressure sensitive adhesive tape that employs a water-dispersible polymer is provided. The adhesive can comprise microparticles and a water-dispersible component; or microparticles and a novel water-dispersible polymer that contains a plurality of poly(alkoxyalkyl)acrylate units as a major component. The tape may be used with labels for containers, sterilization indicator tapes and labels, surgical wrappers, mammalian body coverings, and in the preparation of paper web splices. The tape may be repulpable and/or laundearable.

Pressure sensitive adhesive(s) and articles(s)

A pressure sensitive adhesive that employs a water-dispersible polymer is provided. In one embodiment of the invention the adhesive comprises microparticles and the water-dispersible component. In another embodiment the adhesive comprises a novel water-dispersible polymer that contains a plurality of poly(alkoxyalkyl) acrylate units as a major component. The pressure sensitive adhesive may be provided as a tape and used with labels for containers, sterilization indicator tapes and labels, closure systems for envelopes, surgical wrappers, and mammalian body coverings. It may also be used in the preparation of paper web splices. In one embodiment of the invention the tape is repulpable. In another embodiment it is launderable.

Pressure sensitive adhesive employing a water-dispersible polymer and

Crosslinked, absorbent pressure sensitive adhesive compositions are disclosed comprising an acrylate or methacrylate ester of an alcohol, a hydrophilic alkylene oxide acrylate, a hydrophilic N-vinyl lactam, and an effective amount of a crosslinking agent. The compositions have an enhanced skin adhesion profile and are moderately absorbent. Also disclosed are precursor adhesive compositions and low-profile wound dressings.

Crosslinked absorbent pressure sensitive adhesive and wound dressing

Growing community of inventors

Afton, MN, United States of America

Cheryl L Moore