Motorola Corporation

Cheryl B Field

Joe Pin Wang

Shiuh-Hui Steven Chen

Didier Lefebvre

Michael J Pfeifer

A microdevice assembly () that includes a device microstructure (), a housing (), and a fine grain getter layer (). The housing () has a base portion () and a lid (). The device microstructure () is attached to the base portion () and the lid () is hermetically sealed to the base portion (). The housing () defines a cavity () surrounding the device microstructure (). The fine grain getter layer () is on an interior side () of the lid () for maintaining a vacuum in the cavity () surrounding the device microstructure (). The lid () may be made of metal or have at least a metallic surface in the region where the fine grain getter layer () is applied. The fine grain getter layer () has a sub-micron grain size. There is also a method for making the microdevice assembly ().

Microdevice assembly having a fine grain getter layer for maintaining vacuum

A method of separating a thin die ( ) from a support body ( ) of a semiconductor wafer ( ). The thin die ( ) being initially attached to the support body ( ) by an attachment mechanism ( ). The attachment mechanism may be a plurality of tethers ( ) that extend between the thin die ( ) and the support body ( ). The method may include the steps of: positioning the wafer ( ) on a rigid backing ( ) having a hole ( ), the hole ( ) positioned beneath the thin die ( ); positioning a tip ( ) of a handler ( ) above the thin die ( ), the tip ( ) having a passageway ( ) to a vacuum source; positioning an ejection pin ( ) in a spaced apart relationship beneath the thin die ( ); moving the tip ( ) of the handler ( ) downward toward the thin die ( ) to break the attachment mechanism ( ) and clamp the thin die ( ) between the tip ( ) of the handler ( ) and the ejection pin ( ); and moving the ejection pin ( ) upward in the direction of the tip ( ) of the handler ( ) until the thin die ( ) is extracted from the wafer ( ).

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Kildeer, IL, United States of America

Cheryl B Field