Advanced Micro Devices Corporation

Other

Chern-Jiann Lee

Todd P Lukanc

Mehrdad Mahanpour

Susan H Chen

Ying Shiau

Wiley Eugene Hill

Kurt Taylor

Boon Yong Ang

Yeng-Kaung Peng

Siu-May Ho

David Lin

Chih-Yu Fan

Pu-Gang Fan

Rithy Hang

A light emitting structure has a substrate, a divider, a light guide element and a light emitting element. The divider is connected with the substrate and erected from the substrate. The light guide element is connected with the divider. The divider is positioned in between the substrate and the light guide element. A chamber is delineated by the substrate, the divider and the light guide element. The light emitting element is mounted onto the substrate, surrounded by the divider, accommodated within the chamber and transparent. The light guide element has an external surface, an internal surface and a convex section and/or a concave section. The external surface and the internal surface are oppositely positioned to each other. The external surface faces away from the substrate. The internal surface faces towards the substrate. The convex section and/or the concave section is formed on the external surface and/or the internal surface.

Light emitting structure

A method and apparatus for identifying individual semiconductor die that originate from a semiconductor substrate containing a plurality of die is disclosed. Aspects of the invention include physically associating a respective die ID with at least a portion of individual die on the wafer, and storing the die ID and wafer fabrication information in a database. During subsequent testing of the die, the die ID is used to retrieve the wafer fabrication information from the database, thereby aiding a determination as to a cause of a failure of the die.

Method and apparatus for identifying individual die during failure analysis

A variable design tool utilizes memory units to determine at which point a design rule fails. The variable design tool can provide a bit map indicating the points of failures for particular rules. The bit map can also be utilized to determine misalignment errors. The memory cells, typically SRAM units are arranged in 4&times;4 matrices which are arranged in four 16&times;16 matrices.

Variable design rule tool

Electrical parameter testing and performance testing are performed on a plurality of microelectronic devices to obtain parametric values and performance values respectively. The parametric values are applied as inputs to a computer program such as a back propagation neural network engine which generates a performance prediction model by self-learning that implements a function relating the performance values to the parametric values. The model is used to predict the performance of devices being fabricated by performing electrical parameter testing on these devices and applying the resulting parametric values to the model as inputs to produce predicted performance values as outputs. The model can be configured to produce predicted performance values as percentages of devices having speed or other parameters in predetermined respective ranges. The model can be further configured to produce predicted performance values as percentages of devices having different types of defects. The model can be improved by self-learning using additional test values. The model can also be used to identify parameters which result in low performance and improve devices being fabricated by adjusting the corresponding process parameters.

Method for predicting performance of microelectronic device based on

In a final wafer sort (FWS) testing facility, the raw log-out data that is output by FWS test stations is augmented with additional differentiating data to thereby produce differentiable log-outs that can be sorted according to a variety of criteria including: product number or product family, time of test, specific wafer, specific production lot, intra-reticle site number, machine operator, and the specific swappable units of equipment that participated in the FWS testing. The differentiable log-outs are stored in a database and are periodically accessed by an automatic watchdog system that tests for exception conditions calling for immediate or long-term response. Corresponding alarm signals and trend reports are automatically generated and distributed to responsible personnel and/or reactive machine-systems as appropriate. The alarm distribution mechanism includes automatic paging of personnel by wireless beeper and/or e-mail. Immediate response alarms include exception conditions detected for accumulated bin counts on a per-wafer or per-lot basis. Long term alert reports include those that detect increased error rates and possible wear down of replaceable probe cards.

Watchdog system having data differentiating means for use in monitoring

Growing community of inventors

Los Altos, CA, United States of America

Chern-Jiann Lee