Analog Devices International Unlimited Company

Chern Beng Kang

Teik Tiong Toong

Sok Mun Chew

A package is disclosed. The package includes a substrate and an electrical component vertically mounted to the substrate. The electrical component has a first end, a second end vertically spaced from the first end, and a side wall extending from the first end to the second end. The first end of the electrical component is positioned between the substrate and the second end of the electrical component. The package can also include a molding material disposed at least partially along the side wall of the electrical component.

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Bukit Mertajam, Malaysia

Chern Beng Kang