Carsem (m) Sdn. Bhd.

Carsem Semiconductor Sdn. Bhd.

Carsen Semiconductor Sdn. Bhd.

Cheong Mun Tuck

Chan Boon Meng

Phuah Kian Keung

Lee Huan Sin

Lee Kock Huat

Chen Choon Hing

Araventhan Eturajulu

Liow Eng Keng

Thum Min Kong

The present invention relates to a stress-free lead frame () for a semiconductor. The stress-free lead frame () is provided with a stress-relief means () and an interlocking means () at the outer periphery. The stress-relief means () is capable of accommodating expansion and compression while the interlocking means () take care of shock and vibration during handling to thereby eliminate delamination of the lead frame ().

Stress-free lead frame

The present invention relates to a new method for sawing a moulded leadframe package ( ) into individual integrated circuits ( ). In the present invention sawing of the moulded leadframe package ( ) is done on the leads ( ) instead of on the connecting bar ( ) resulting in less heat being generated during cutting. This results in higher cutting speed and longer dicing blade life.

Method for sawing a moulded leadframe package

Growing community of inventors

Ipoh, Malaysia

Cheong Mun Tuck