Samsung Electro-mechanics Co., Ltd.

Cheong Kim

Chung Yeol Lee

Hee Jung Jung

Hiroki Okada

Jun Il Kang

Jong Rock Lee

Jin Hyung Lim

A multilayer electronic component, may include: a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, in which a lattice-type groove shape having a plurality of grooves arranged in a lattice form may be formed in at least a portion of a surface of the body.

Multilayer electronic component

A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including a base electrode layer disposed on the body and including a first metal element, and an alloy layer and a plating layer, sequentially disposed on the base electrode layer. The alloy layer includes a first alloy layer disposed to contact the base electrode layer and including an alloy of the first metal element and Sn, and a second alloy layer disposed to contact the first alloy layer and including an alloy of Ni and Sn, and the plating layer includes an Ni plating layer disposed to contact the second alloy layer.

Multilayer electronic component having external electrode including alloy layer between base electrode layer and plating layer

A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body and including an electrode plating layer disposed to at least partially contact the internal electrodes, and a plating layer disposed on the electrode plating layer. The electrode plating layer may include a plurality of first crystal grains having a major axis of 0.2 μm or more, and the plurality of first crystal grains may have an average ratio of a major diameter to a minor axis to 1:1 to 3:1.

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Suwon-si, South Korea

Cheong Kim