Cheil Industries Inc.

Cheon Seok Lee

Kyoung Soo Park

Kang Bae Yoon

Hyun Hee Namkung

Byeong Hwan Jeon

Kyoung Hun Shin

Hyun Joo Seo

Bong Yong Kim

Choun Woo Lee

Ju Kwang Park

Kyong Hun Shin

Young Jin Kwon

Hye Kyoung Cho

Hee Young Oh

Disclosed is a resin composition including a cardo resin. Exemplary resin compositions can include (a) a cardo resin having a structural unit represented by Formula 1, (b) a reactive unsaturated compound, (c) an initiator, and (d) a solvent,  (R&#x2550;H, Et, CHCl, CHOH, CHCH&#x2550;CHor Ph), and k is integer from 1 to 40. Further disclosed is a color filter which includes a fine pattern formed using the composition. The color filter can exhibit superior resistance to heat and chemicals, improved developability, and good adhesiveness.

Resin composition comprising cardo resin, method for forming pattern using the resin composition and color filter using pattern formed by the method

An anisotropic conductive adhesive composition includes an acrylic rubber binder having a weight average molecular weight of about 100,000 to about 1,000,000, a first component including at least one of a mono(meth)acrylate compound and a di(meth)acrylate compound, a second component including at least one of a tri(meth)acrylate compound and a compound having more than three (meth)acrylate groups, an organic peroxisde, and conductive particles. The second component is present in an amount of about 1 to about 10% by weight, based on the total weight of the acrylic rubber, the first component, the second component, the organic peroxide, and the conductive particles.

Anisotropic conductive adhesive composition, anisotropic conductive film comprising the same, and associated methods

An adhesive composition includes an ethylene-vinyl acetate copolymer, a copolymer of an aliphatic heterocyclic compound and a monomer having an aromatic ring, a binder resin, a radical polymerizable material, and a radical initiator.

Adhesive composition and anisotropic conductive film using the same

An anisotropic conductive film (ACF) composition includes a thermoplastic resin having a weight average molecular weight of about 150,000 to about 600,000, a thermosetting curing agent having a weight average molecular weight of about 100 to about 10,000, the thermosetting curing agent including an acrylate functional group or a methacrylate functional group, an organic peroxide, a silane coupling agent, and conductive particles.

Anisotropic conductive film composition and film including the same

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Seongnam-si, South Korea

Cheon Seok Lee