Samsung Electro-mechanics Co., Ltd.

Cheol Min Shin

Sang Hoon Kim

Yong Duk Lee

Suk Chang Hong

Woo Jeong Choi

Ki Gon Kim

A printed circuit board includes: a substrate layer in which a plurality of insulating layers and a plurality of wiring patterns are repeatedly layered, the substrate layer including a conductive via layer disposed in one of the plurality of insulating layers to connect wiring patterns, among the plurality of wiring patterns, disposed on upper and lower surfaces of the one insulating layer, respectively; an uppermost substrate layer including an outermost insulating layer disposed outermost within the substrate layer, and a first upper wiring pattern disposed in the outermost insulating layer; and a bump pad disposed on a portion of an upper surface of the first upper wiring pattern and having a length shorter than a length of the first upper wiring pattern.

Growing community of inventors

Suwon-si, South Korea

Cheol Min Shin