Samsung Display Co., Ltd.

Philoptics Co., Ltd

Cheol Lae Roh

Tae Yong Kim

Hyung-Sik Kim

Myung Soo Huh

Jin-Han Park

Gyoo Wan Han

Joon-Hyung Kim

Je Kil Ryu

Il Young Jeong

Seung-Ho Myoung

Jong-Dae Kim

Jong Nam Moon

Tae Hyoung Cho

Jeong Hun Woo

Ki Su Han

Keun Woo Park

Woo Jin Kim

Heung Cheol Jeong

Dong Kyun Ko

Do Hun Lee

Byung Chul Lee

Sung Chui Kim

Provided are an inkjet printing apparatus and a method for inspecting an inkjet head using same. The inkjet printing apparatus comprises: an inspection stage unit on which an inspection substrate is seated; an inkjet head unit including at least one inkjet head that ejects ink containing dipoles and a solvent in which the dipoles disperse, on the inspection stage unit; and a particle count inspection unit that is located so as to be spaced apart from the inkjet head unit in one direction. The particle count inspection unit comprises: a first heat treatment unit that is located on the top portion of the inspection stage unit; and a first sensing unit that is located on the bottom portion of the inspection stage unit and measures the number of dipoles sprayed onto the inspection substrate.

Inkjet printing apparatus and method for inspecting inkjet head using same

A method of manufacturing a metal oxide film includes injecting a reaction gas and metal precursors into a chamber, forming a first metal precursor film on a substrate in a plasma OFF state, forming a first sub-metal oxide film by oxidizing the first metal precursor film in a plasma ON state, and forming a second metal precursor film on the first sub-metal oxide film in the plasma OFF state, where the metal oxide film has an amorphous phase, a thickness of about 20 nanometer (nm) to about 130 nm, and a dielectric constant of about 10 to about 50.

Method of manufacturing metal oxide film and display device including metal oxide film

A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

Method for cutting substrate

A sealing apparatus and a method of manufacturing a flat display device using the sealing apparatus. The sealing apparatus to attach a first substrate and a second substrate to each other using an attachment member disposed between the first and second substrates, the sealing apparatus comprises a stage on which the first substrate is seated, a halogen lamp irradiating light, and a reflector reflecting light irradiated from the halogen lamp to the attachment member.

Sealing apparatus and method of manufacturing flat display device using the same

Growing community of inventors

Asan-si, South Korea

Cheol Lae Roh