Samsung Display Co., Ltd.

Samsung Mobile Display Co., Ltd.

Cheol-Lae Roh

Hyun-Chul Lee

Jae-Seok Park

Won-Kyu Lim

Jin-Han Park

Joon-Hyung Kim

Jae-Hong Ahn

Sang-Jin Han

Yong-Jin Lee

Min-Gyu Seo

Tae-Wook Kang

Myung-Soo Huh

Suk-Won Jung

Hyung-Sik Kim

Alexander Voronov

Gyoo-Wan Han

Seung-Ho Choi

Jang-Hwan Shin

Jae-Hyun Kim

Jin-Kwang Kim

Jong-Dae Kim

Cheol-Min Jang

Jong-Heon Kim

Chang-Mog Jo

Dong-Sul Kim

Sung-Gon Kim

Eui-Shin Shin

Kang-Il Lee

Young-Geun Cho

Hyun-Keun Song

A linear evaporation source and a deposition apparatus having the same are disclosed. In one aspect, the linear evaporation source includes i) a crucible being open on one side thereof and configured to store a deposition material and ii) a plurality of partitions dividing an internal space of the crucible, wherein each of the partitions has at least one opening in a lower portion thereof. The source further includes i) a nozzle section located on the open side of the crucible and comprising a plurality of nozzles, ii) a heater configured to heat the crucible and iii) a housing configured to accommodate the crucible, the nozzle section, and the heater.

Linear evaporation source and deposition apparatus having the same

A linear evaporation source and a deposition apparatus having the same are disclosed. In one embodiment, the linear evaporation source includes i) a crucible being open on one side thereof and configured to store a deposition material and ii) a plurality of partitions dividing an internal space of the crucible, wherein each of the partitions has at least one opening in a lower portion thereof. The source further includes i) a nozzle section located on the open side of the crucible and comprising a plurality of nozzles, ii) a heater configured to heat the crucible and iii) a housing configured to accommodate the crucible, the nozzle section, and the heater.

A method of forming nanocrystals and a method of manufacturing an organic light-emitting display apparatus that includes a metal compound thin film having the nanocrystals. The method of forming nanocrystals includes forming a metal compound thin film under a first pressure by using a reactive sputtering process, and forming the nanocrystals in the metal compound thin film under a second pressure that is lower than the first pressure by using the reactive sputtering process.

Method of forming nano crystals and method of manufacturing organic light-emitting display apparatus including thin film having the same

An organic light-emitting apparatus including: a substrate; an organic light-emitting device disposed on the substrate and including a first electrode, a second electrode, and an intermediate layer disposed between the first electrode and the second electrode; and an encapsulation layer provided to cover the organic light-emitting device. The encapsulation layer includes a first inorganic layer including a first fracture point, and a first fracture control layer provided on the first inorganic layer to seal the first fracture point.

Organic light-emitting apparatus and method of manufacturing the same

Provided is a mask for an evaporation apparatus, which includes a first division mask and a second division mask. The first and second division masks are directly bonded to each other by welding, thereby forming welding portion between the first and the second division masks. A method and apparatus for manufacturing a mask for evaporation are also provided. The division masks according to the embodiment do not use subframes, and are directly bonded to one another by welding, so that a shadow effect does not occur. The apparatus for manufacturing a mask for evaporation includes a work stage, a clamp fixing a first division mask and a second division mask to the work stage, and a laser welding part welding the first division mask to the second division mask. The apparatus may further include a first roller leading the laser welding part and a second roller following the laser welding part.

Mask for evaporation, and method and apparatus for manufacturing the same

A substrate cutting apparatus includes a stage configured to support a substrate, a first laser generator configured to emit a first laser beam toward the substrate, the first laser beam being a short-pulse laser beam, and a beam swing unit disposed on a beam path of the first laser beam, the beam swing unit being configured to swing the first laser beam in a predetermined light irradiating section on the substrate, the light irradiating section on the substrate including at least one of a curved line section and a straight line section.

Substrate cutting apparatus and method for cutting substrate using the same

A method of depositing a material on a substrate is provided for use in manufacturing electronic and display devices such as semiconductors, liquid crystal displays, and organic light emitting diode displays. A deposition material stored in a first deposition source section is heated to evaporate the deposition material. A second deposition source section, which is separate from the first deposition source section, is cooled. The first deposition source section is cooled, and deposition material stored in a second deposition source section is heated so as to alternately supply evaporated deposition material from the first and second deposition source sections to a feed section. The evaporated deposition material from the feed section is supplied to a nozzle section. A substrate can be provided to receive the evaporated deposition material from the nozzle section. A thin film of deposition material can then be formed on the substrate.

Method of forming thin film from multiple deposition sources

An organic light-emitting display device includes a first substrate including an organic light-emitting diode and a plurality of electrodes connected to the organic light-emitting diode, the plurality of electrodes extending on the first substrate along a first direction toward an edge of the first substrate, a second substrate connected to the first substrate, the second substrate being shorter than the first substrate and exposing a portion of the plurality of electrodes on the first substrate, a sealing material disposed between the first substrate and the second substrate to surround the organic light-emitting diode, and an electrode protecting layer partially covering the exposed portion of the plurality of electrodes on the first substrate, a first side of the electrode protecting layer being between the first substrate and the second substrate, and a second side of the electrode protecting layer protruding beyond the second substrate.

Organic light-emitting display device and method of manufacturing the same

A linear evaporation source and a deposition apparatus having the same are disclosed. In one embodiment, the linear evaporation source includes i) a crucible being open on one side thereof and configured to store a deposition material and ii) a plurality of partitions dividing an internal space of the crucible, wherein each of the partitions has at least one opening in a lower portion thereof. The source further includes i) a nozzle section located on the open side of the crucible and comprising a plurality of nozzles, ii) a heater configured to heat the crucible and iii) a housing configured to accommodate to the crucible, the nozzle section, and the heater.

A laser cutting method includes providing a multi-layered substrate, such that the multi-layered substrate includes a circuit pattern between stacked first and second substrates, and removing a part of the second substrate by irradiating a laser beam on the second substrate, the laser beam being irradiated at an oblique angle with respect to an upper surface of the second substrate.

Laser cutting method and method of manufacturing organic light-emitting device

A method of manufacturing a flat panel display is disclosed. In one aspect, the method includes preparing first and second mother substrates, forming a plurality of display cells on at least one of the mother substrates, forming a plurality of sealant lines enclosing the respective cells on either one of the mother substrates and assembling and sealing the two mother substrates with the sealant lines interposed therebetween. The method also includes mounting the two mother substrates on a stage, irradiating a laser beam to a defined light irradiation region of the mother substrates and cutting the mother substrates while moving the light irradiation region along an imaginary cut line where the mother substrates are to be cut. The light irradiation region includes a linear region and a curved region.

Flat panel display and manufacturing method thereof

A flat panel display is disclosed. In one embodiment, the display includes i) a first substrate including a display area, wherein at least one display element is formed in the display area, ii) a second substrate covering the display area and connected to the first substrate, iii) a sealant formed between the first and second substrates. In one embodiment, the first substrate and the second substrate comprise a first cut surface and a second cut surface, respectively. Further, each of the first cut surface and the second cut surface has a plurality of corners each of which is concave from the perspective of the display area.

A laser irradiation apparatus for bonding a first substrate and a second substrate of a display device by melting a plurality of bonding members disposed between the first and second substrates to define cells when the display device is manufactured, the display device including light emitting elements disposed on a surface of the first substrate such that the bonding members respectively encompass lateral regions of the light emitting elements, the laser irradiation apparatus including a stage on which the first substrate is mounted, a laser oscillation member configured to irradiate a laser beam that melts the bonding members disposed between the first substrate and the second substrate, and a scanner configured to irradiate the laser beam incident from the laser oscillation member onto the bonding members, the scanner being configured to sequentially irradiate the laser beam on portions of the bonding members.

Growing community of inventors

Yongin, South Korea

Cheol-Lae Roh