Samsung Electronics Co., Ltd.

Cheol Jun Yoo

Young Hee Song

Seong Ik Hong

Seong Deok Hwang

Sang Hyun Lee

Min Jung Kim

Jong Sup Song

Hak Hwan Kim

Chang Hoon Kwak

Kyu Jin Lee

Jae Sung You

Kyung Mi Moon

Ill Heoung Choi

Il Han Park

Il Woo Park

Ii Woo Park

There is provided a light emitting element package including: a light emitting laminate having a structure in which semiconductor layers are laminated and having a first main surface and a second main surface opposing the first main surface; a terminal unit disposed on an electrode disposed on the second main surface; a molded unit disposed on the second main surface of the light emitting laminate and allowing a portion of the terminal unit to be exposed; and a wavelength conversion unit disposed on the first main surface of the light emitting laminate.

Light emitting element package and method of manufacturing the same

There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package and LED package manufactured thereby

A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.

Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof

A light source module including: a cover unit having a pipe structure with one open end or two open ends; a cap unit coupled to the one open end or two open ends of the cover unit; a light source unit including a light emitting device, the light source unit mounted on the cap unit and covered by the cover unit; and a wavelength conversion unit disposed in an internal space of the cover unit and coupled to the light source unit while covering the light emitting device, the wavelength conversion unit converting a wavelength of light emitted from the light emitting device to allow the wavelength-converted light to be emitted through the cover unit.

Light source module and illumination apparatus having the same

A light emitting diode (LED) package and a manufacturing method thereof are provided. The LED package includes a substrate including a circuit layer, an LED mounted on the substrate, and a plurality of protruded reflection units disposed in a region excluding an LED mounting region on the substrate and configured to reflect light generated from the LED.

Light emitting diode package and manufacturing method thereof

An illumination device includes a main body unit, a light source module and a cover unit. The light source module is disposed in an upper space of the main body unit to be separated therefrom and includes a substrate and at least one light emitting device respectively disposed on both surfaces of the substrate. The cover unit is disposed on the main body unit to cover the light source module and allowing light emitted from the light source module to be emitted from a surface of the cover unit in a radial manner.

Illumination device

Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package, and LED package manufactured thereby

Provided are a mask for an application of paste and a method of manufacturing a semiconductor light emitting device by using the same. The method includes preparing a light emitting structure including first and second conductive semiconductor layers and an active layer disposed therebetween, which has at least one electrode formed on a surface of the light emitting structure; disposing a mask having an open part exposing a portion of the surface of the light emitting structure therethrough and a recess part corresponding the electrode in a region thereof on a surface of the light emitting structure; and applying wavelength conversion material-containing paste to the surface of the light emitting structure through the open part.

Method of manufacturing semiconductor light emitting device and mask for application of paste used therefor

Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device.

Light emitting device package and method of manufacturing the same

There is provided a light emitting device package including: a substrate having a circuit pattern formed on at least one surface thereof and including an opening; a wavelength conversion layer formed by filling at least a portion of the opening with a wavelength conversion material; and at least one light emitting device disposed on a surface of the wavelength conversion layer and electrically connected to the circuit pattern.

Growing community of inventors

Chungcheongnam-do, South Korea

Cheol Jun Yoo