Samsung Electro-mechanics Co., Ltd.

Cheol Ho Heo

Young Ki Lee

Sang Hyun Shin

Myung Gun Chong

Sang Hyuk Son

Dae Hyung You

Tae Yong Lee

Ji Hyun Park

Ki Ho Seo

The present invention relates to a printed circuit board. A heat radiation coating material is applied to a portion of a circuit layer formed on an outermost portion of the printed circuit board, thereby making it possible to improve heat radiation performance of the printed circuit board. The heat radiation coating material also serves as a solder resist, thereby making it possible to insulate and protect the printed circuit board without a separate solder resist.

Printed circuit board

The present invention relates to a metallic laminate and a manufacturing method of a light emitting diode package using the same. The present invention provides a metallic laminate including: a core layer made of an insulating material; a metal layer disposed on one surface of the core layer; a heat radiating metal layer disposed on the other surface of the core layer; and a protective metal oxide layer disposed along an outer surface of the heat radiating metal layer and made of an oxide of the heat radiating metal layer.

Metallic laminate and manufacturing method of light emitting diode package using the same

The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.

Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate

Growing community of inventors

Busan, South Korea

Cheol Ho Heo